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| 型號： | 143 |
| 廠商： | BI Technologies Corporation |
| 英文描述： | Custom Commercial Modules |
| 中文描述： | 自定義商業(yè)模塊 |
| 文件頁數(shù)： | 3/3頁 |
| 文件大?。?/td> | 128K |
| 代理商： | 143 |
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Model 143
CERAMIC BOARD (A)
Our hybrids use ceramic (alumina) substrates to
achieve optimum size reduction and reliability.
Ceramic substrates produce an environmentally
superior product. The advantages of ceramic over
polymer board construction include: better heat
dissipation, elimination of blistering, minimal moisture
absorption, reduced size and improved performance.
For small-sized assemblies (up to approx. 2” x 2”),
ceramic board construction is usually the low cost
choice. Thick film conductors, typically Palladium
silver or gold, as small as 5 mil wide, are screened
onto the substrate. Multilayer construction of up to
five metal layers is standard.
PRECISION SCREENED RESISTORS (B)
Thick film resistors are screened directly onto the
substrate utilizing a wide range of resistor inks,
yielding high precision at low cost. Our thick film
resistors can be ratio matched to 0.1% with absolute
tolerances of 0.5%. Thick film resistors can be located
underneath surface mount devices, or screened onto
the back of the substrate for increased circuit
densities.
INTERCONNECT FLEXIBILITY (C)
Lead frames can be attached to accommodate a variety
of interconnection requirements. Leads can be affixed
to any or all edges of the substrate and can be
configured for various mounting styles. Additionally, a
wide variety of standard sockets can be attached to
allow plug-in capability to your next level of assembly.
SURFACE MOUNT SEMICONDUCTORS (D)
BI has experience with a wide range of surface
mountable
semiconductors
configurations, including SOT, SO, SOL and PLCC.
Our commercial hybrids will also accommodate
semiconductor die attached and wire bonded directly
to the substrate. This allows us to utilize ASICs and
other semiconductors not currently offered in a
surface mountable package.
in
packaged
SURFACE MOUNT PASSIVE COMPONENTS (E)
Ceramic and tantalum capacitors, chip inductors and
resistor chips all lend themselves to surface mount
assembly. Axial leaded components can be formed
and mounted as well.
ENCAPSULATION (F)
Surface mount hybrids do not normally require
encapsulation. However, encapsulation may be
applied if desired for rigidity or for protection of
proprietary circuit design. When chip and wire
elements are used, these are generally individually
“glob-topped” to provide protection for the device; the
entire module may then be fully encapsulated.
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