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參數(shù)資料
| 型號(hào)： | 1410142-1 |
| 廠商： | Tyco Electronics |
| 元件分類： | 終端 |
| 英文描述： | VITA 46 Connectors |
| 中文描述： | VITA 46 連接器 |
| 文件頁數(shù)： | 2/6頁 |
| 文件大?。?/td> | 456K |
| 代理商： | 1410142-1 |
www.
te.com/products/2Piece-High-Speed
High Speed Backplane Connectors
TE Connectivity
Signal Integrity at TE
TE Connectivity gets the best performance out of connectors by applying system-level signal integrity design expertise to each high-speed product.
Our modeling and simulation skills are second to none with global expertise in the U.S., Europe, and Asia. Our global presence places simulation,
modeling, and system layout experts next to the customer.
Modeling and Simulation
At TE the design process starts with signal integrity. Signal integrity engineers use sophisticated 3D tools to provide accurate connector and footprint
via pattern performance prior to production. TE has the tools and expertise to get the right answer.
n
Ansys HFSS and CST
Microwave Studio Full-wave
3D tools
n
Both connector and footprint
via pattern(s) analyzed
before production
n
S-parameter and SPICE
analysis
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Sophisticated ADS and
MATLAB system analysis
Customer Support and Tools
From test boards to simulation models, TE provides a library of tools that help you successfully implement your system.
Requests can be easily made through our signal integrity website: www.te.com/documentation/electrical-models
n
Ansys HFSS and CST Microwave Studio Full-wave 3D tools
n
Both connector and footprint via pattern(s) analyzed before
production
n
S-parameter and SPICE analysis
n
Sophisticated ADS and MATLAB system analysis
n
Measurement based S-parameter connector models (64+ ports)
n
Modeling based S-parameter connector models (64+ ports)
n
Footprint via pattern S-parameter and SPICE models
n
SPICE connector models
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Connector evaluation test boards
n
System test boards
Test Capability
With measurement capabilities beyond 12.5 Gbps and 50 GHz, TE can characterize and provide detailed measurements for its products. Cutting-edge
measurement calibration techniques and board design enable accurate de-embedding of test fixtures. TE has also teamed with numerous silicon com-
panies to provide active device measurements that can be invaluable to assure the successful implementation of a design.
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Advanced calibration techniques de-embed fixture
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Frequency domain to 50 GHz
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Time domain eye pattern/BERT to 12.5 Gbps
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Active silicon testing – multiple vendors 2 – 10+ Gbps
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Both system and “connector only” boards
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 1410187-3 | VITA 46 Connectors |
| 14123-02 | INDUCTOR ASSY, OUTPUT, 1.8 uH |
| 14123 | INDUCTOR ASSY, OUTPUT, 1.8 uH |
| 1413009-9 | Automotive Relays |
| 6-1414920-1 | Automotive Relays |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 1410142-1 | 制造商:TE Connectivity 功能描述:RECEPTACLE 144WAY PRESS FIT |
| 1410142-2 | 功能描述:高速/模塊連接器 MULTIGIG RT T2 .8" BP FULL RGHT RoHS:否 制造商:Molex 系列:iPass 產(chǎn)品類型: 排數(shù): 列數(shù): 位置/觸點(diǎn)數(shù)量:38 安裝角:Right 節(jié)距:0.8 mm 安裝風(fēng)格:Plug 端接類型:SMD/SMT 外殼材料:Thermoplastic 觸點(diǎn)材料:High Performance Alloy (HPA) 觸點(diǎn)電鍍:Gold |
| 1410147 | 制造商:Phoenix Contact 功能描述:VS-FSBPXS-OE-94F/10 0 |
| 1410147-1 | 功能描述:高速/模塊連接器 V-41 R/A PLG CTR-MOD P0 RoHS:否 制造商:Molex 系列:iPass 產(chǎn)品類型: 排數(shù): 列數(shù): 位置/觸點(diǎn)數(shù)量:38 安裝角:Right 節(jié)距:0.8 mm 安裝風(fēng)格:Plug 端接類型:SMD/SMT 外殼材料:Thermoplastic 觸點(diǎn)材料:High Performance Alloy (HPA) 觸點(diǎn)電鍍:Gold |
| 1410147-1 | 制造商:TE Connectivity 功能描述:Backplane Connector |
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