Board Mountable
DC-DC Converters
IML 10 Series
Edition 6/4.2000
7/7
Accessories
Mounting supports for chassis and DIN-rail mounting.
Option C
The C-pinout configures the electrically isolated double out-
puts to the "industrial pinout" Vo1+, Vo2– with common
ground Go. With the C-pinout the converter height is in-
creased by the adapter PCB (see also:
Mechanical Data).
Fig. 8
Proposed solder lands option M
Option M and L
Surface mount version
Note: Precautions should be taken when reflow soldering
the SMD version. The reflow soldering instructions below
should be strictly adhered to. An inadequate soldering pro-
cess may permanently damage the converter or degrade
its performance and Power-One will not honour any gua-
rantee/warranty claims resulting from damage caused by
ignoring the soldering instructions.
Infrared soldering is not permitted.
The surface mountable version of this product is assem-
bled with high melting point solder (227
°C) to ensure that
the solder joints of of the internal components do not de-
grade in the end users SMD soldering process.
This product is only specified for "Forced Convection
Reflow Soldering" (Hot Air). Any conventional soldering
profile is acceptable provided that the restriction curve be-
low is not exceeded at any time during the reflow process.
210
220
230
240
0
10
20
30
Tpeak [°C]
11051
40
t [s]
50
205
215
225
235
Fig. 7
Forced convection reflow soldering restriction curve
measured on pin 2
50
3.81
Top view
09119
4
x
3.81
25.4
3
x
5.8
3.81
4
2
Fig. 9
Proposed solder lands option L
24
(0.94")
2.8
(0.11")
3.6 (1.4")
8 x 5 (1.9")
Foot print
Description of Options
Table 7: Survey of options
Option
Function of option
Characteristic
C
C-pinout
M
Surface mount version with pins
Standard pin-out
L
Surface mount version with PCB lid
Macrodense pin-out
Z
Open frame
Available for all versions