參數(shù)資料
型號: 100-1221-3
廠商: Bluetechnix
文件頁數(shù): 23/68頁
文件大?。?/td> 0K
描述: CORE MOD CM-BF537E 600MHZ CONN
標準包裝: 1
模塊/板類型: 核心模塊
其它名稱: 100-1221
100-1221-ND
Rev. J
|
Page 3 of 68
|
February 2014
GENERAL DESCRIPTION
The ADSP-BF534/ADSP-BF536/ADSP-BF537 processors are
members of the Blackfin
family of products, incorporating the
Analog Devices, Inc./Intel Micro Signal Architecture (MSA).
Blackfin processors combine a dual-MAC, state-of-the-art sig-
nal processing engine, the advantages of a clean, orthogonal
RISC-like microprocessor instruction set, and single-instruc-
tion, multiple-data (SIMD) multimedia capabilities into a single
instruction-set architecture.
The ADSP-BF534/ADSP-BF536/ADSP-BF537 processors are
completely code and pin compatible. They differ only with
respect to their performance, on-chip memory, and presence of
the Ethernet MAC module. Specific performance, memory, and
feature configurations are shown in Table 1.
By integrating a rich set of industry-leading system peripherals
and memory, the Blackfin processors are the platform of choice
for next-generation applications that require RISC-like pro-
grammability, multimedia support, and leading-edge signal
processing in one integrated package.
PORTABLE LOW POWER ARCHITECTURE
Blackfin processors provide world-class power management
and performance. They are produced with a low power and low
voltage design methodology and feature on-chip dynamic
power management, which is the ability to vary both the voltage
and frequency of operation to significantly lower overall power
consumption. This capability can result in a substantial reduc-
tion in power consumption, compared with just varying the
frequency of operation. This allows longer battery life for
portable appliances.
SYSTEM INTEGRATION
The Blackfin processor is a highly integrated system-on-a-chip
solution for the next generation of embedded network-con-
nected applications. By combining industry-standard interfaces
with a high performance signal processing core, cost-effective
applications can be developed quickly, without the need for
costly external components. The system peripherals include an
IEEE-compliant 802.3 10/100 Ethernet MAC (ADSP-BF536 and
ADSP-BF537 only), a CAN 2.0B controller, a TWI controller,
two UART ports, an SPI port, two serial ports (SPORTs), nine
general-purpose 32-bit timers (eight with PWM capability), a
real-time clock, a watchdog timer, and a parallel peripheral
interface (PPI).
BLACKFIN PROCESSOR PERIPHERALS
The ADSP-BF534/ADSP-BF536/ADSP-BF537 processors con-
tain a rich set of peripherals connected to the core via several
high bandwidth buses, providing flexibility in system configura-
tion as well as excellent overall system performance (see
Figure 1). The processors contain dedicated network communi-
cation modules and high speed serial and parallel ports, an
interrupt controller for flexible management of interrupts from
the on-chip peripherals or external sources, and power manage-
ment control functions to tailor the performance and power
characteristics of the processor and system to many application
scenarios.
All of the peripherals, except for the general-purpose I/O, CAN,
TWI, real-time clock, and timers, are supported by a flexible
DMA structure. There are also separate memory DMA channels
dedicated to data transfers between the processor’s various
memory spaces, including external SDRAM and asynchronous
memory. Multiple on-chip buses running at up to 133 MHz
provide enough bandwidth to keep the processor core running
along with activity on all of the on-chip and external
peripherals.
The Blackfin processors include an on-chip voltage regulator in
support of the processors’ dynamic power management capabil-
ity. The voltage regulator provides a range of core voltage levels
when supplied from VDDEXT. The voltage regulator can be
bypassed at the user’s discretion.
Table 1. Processor Comparison
Features
ADSP
-BF534
ADSP
-BF536
ADSP
-BF537
Ethernet MAC
1
CAN
1
TWI
1
SPORTs
2
UARTs
2
SPI
1
GP Timers
8
Watchdog Timers
1
RTC
1
Parallel Peripheral Interface
1
GPIOs
48
Memory
Configuration
L1 Instruction
SRAM/Cache
16K bytes
16K bytes 16K bytes
L1 Instruction
SRAM
48K bytes
48K bytes 48K bytes
L1 Data
SRAM/Cache
32K bytes
32K bytes 32K bytes
L1 Data SRAM 32K bytes
32K bytes
L1 Scratchpad 4K bytes
4K bytes
L3 Boot ROM
2K bytes
Maximum Speed Grade
500 MHz
400 MHz
600 MHz
Package Options:
CSP_BGA
208-Ball
182-Ball
208-Ball
182-Ball
208-Ball
182-Ball
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