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參數(shù)資料
| 型號： | 0826B50-100J |
| 廠商： | ANAREN INC |
| 元件分類： | 射頻變壓器 |
| 英文描述： | 800 MHz - 2600 MHz RF TRANSFORMER |
| 文件頁數(shù)： | 8/12頁 |
| 文件大?。?/td> | 725K |
| 代理商： | 0826B50-100J |
Available on Tape
and Reel for Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe
:
(315) 432-8909
(800) 411-6596
+44 2392-232392
Model 0826B50-100J
Rev A
5. Clean excess flux from board, and any other
debris. Apply small amounts of solder paste
(SN63PB37 or equivalent) to each pad on
board.
7. Using a hand held soldering iron with Metcal solder
tip STTC-042 or equivalent, place tweezers on top of
component for support, place iron on exposed plated
area reflowing solder paste and tin-lead plating on part.
(Repeat for each pad) If necessary apply water-soluble
liquid flux to each pad and touch solder iron to exposed
plated area to complete the proper solder connection.
6. Place component on solder paste and align to pads.
8. Inspect all pads to ensure solder connection to
component pads and PWB pads. Clean excess flux
from component and PWB.
.
Mounting parts in High Volume Pick and Place
Component Mounting Process
The process for assembling this component in a conventional surface mount process is shown below. This process
is conducive to both low and high volume usage.
Clean
Substrate
Apply
Solder Paste
to Substrate
Reflow
component
to substrate
Place
component
on substrate
Clean &
Inspect
Surface Mounting Process Steps
Storage of Components: Commonly used storage procedures used to control oxidation should be followed for
these surface mount components. The storage temperatures should be held between 15OC and 60OC.
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