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參數(shù)資料
| 型號： | 0810B50-75J |
| 廠商： | ANAREN INC |
| 元件分類： | 射頻變壓器 |
| 英文描述： | 800 MHz - 1000 MHz RF TRANSFORMER |
| 文件頁數(shù)： | 9/12頁 |
| 文件大?。?/td> | 680K |
| 代理商： | 0810B50-75J |
USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 411-6596
+44 2392-232392
Available on Tape and
Reel for Pick and Place
Manufacturing.
Model 0810B50-75J
Rev A
Substrate: Depending upon the particular component, the circuit material has an x and y coefficient of thermal
expansion of between 17 and 25 ppm/°C. This coefficient minimizes solder joint stresses due to similar expansion
rates of most commonly used board substrates such as RF35, RO4350, FR4, polyimide and G-10 materials.
Mounting to “hard” substrates (alumina etc.) is possible depending upon operational temperature requirements. The
solder surfaces of the coupler are all copper plated with a tin-lead exterior finish.
Solder Paste: All conventional solder paste formulations will work well with Anaren’s surface mount components.
Solder paste can be applied with stencils or syringe dispensers. An example of a stenciled solder paste deposit is
shown below. As shown in the figure solder paste is applied to the RF and ground pads.
Solder Paste Application
Component Positioning: These surface mount components are placed with automatic pick and place mechanisms.
A place component is shown below.
Component Placement
The exploded view of the PWB, solder paste and component is shown below.
Exploded Mounting Features
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