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參數(shù)資料
| 型號(hào)： | 0810B50-100J |
| 廠商： | ANAREN INC |
| 元件分類： | 射頻變壓器 |
| 英文描述： | 800 MHz - 1000 MHz RF TRANSFORMER |
| 文件頁(yè)數(shù)： | 8/13頁(yè) |
| 文件大?。?/td> | 682K |
| 代理商： | 0810B50-100J |
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USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 411-6596
+44 2392-232392
Available on Tape and
Reel for Pick and Place
Manufacturing.
Model 0810B50-100J
Rev A
No Bias Footprint
Mounting Footprint
Dimensions are in Inches [Millimeters]
6X .002
[0.05]
Plated thru
holes to
ground
3X Transmission
Line
Solder Resist
Footprint Pad (s)
Circuit Pattern
4X .010
[0.25]
6X .016
[0.35]
6X .013
[0.33]
.026
[0.66]
DC Bias Footprint
DC Bias
.026
[0.66]
4X .010
[0.25]
6X .013
[0.33]
6X .016
[0.35]
Mounting Footprint
Dimensions are in Inches [Millimeters]
6X .002
[0.05]
Plated thru
hole to
ground
3X Transmission
Line
Circuit Pattern
Footprint Pad (s)
Solder Resist
Manufacturing Instructions
This section contains mounting instructions for hand soldering components in a lab environment and high volume pick
and place operations.
Mounting parts in a lab environment
The following steps outline the process for hand soldering Anaren’s components to pre-populated PWBs.
1. The picture to the right shows the mounting location
for the component to be installed.
3. The picture to the right shows the mounting location
with excess solder removed.
2. Using solder wick and water-soluble flux, remove
excess solder from pads where component will be
mounted.
4. There needs to be exposed copper/plated area to
place solder iron to transfer heat to the component
pads. The picture to the right shows areas of exposed
tin-lead plating where the soldering tip will be placed for
heat transfer.
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