參數(shù)資料
型號(hào)： 0805B104K500N
廠商： Electronic Theatre Controls, Inc.
英文描述： CERAMIC MULTILAYER CAPACITORS
中文描述： 多層陶瓷電容器
文件頁數(shù)： 52/52頁
文件大小： 2571K
代理商： 0805B104K500N
BOARD DESIGN CONSIDERATIONS
The amount of solder applied to the chip capacitor will influence the reliability of the
device. Excessive solder can create thermal and tensile stresses on the component
which could lead to fracturing of the chip or the solder joint itself. Insufficient or
uneven solder application can result in weak bonds, rotation of the device off line or lift-
ing of one terminal off the pad (tombstoning).
The volume of solder is process and board pad size dependent. WAVE SOLDERING exposes the
devices to a large solder volume, hence the pad size area must be restricted to accept an amount of solder which is not detrimental to
the chip size utilized. Typically the pad width is 66% of the component width, and the length is .030” (.760 mm) longer than the termi-
nation band on the chip. An 0805 chip which is .050” wide and has a .020” termination band therefore requires a pad .033” wide by
.050” in length. Opposing pads should be identical in size to preclude uneven solder fillets and mismatched surface tension forces which
can misalign the device. It is preferred that the pad layout results in alignment of the long axis of the chips at right angles to the solder
wave, to promote even wetting of all terminals. Orientation of components in line with the board travel direction may require dual
waves with solder turbulence to preclude cold solder joints on the trailing terminals of the devices, as these are blocked from full expo-
sure to the solder by the body of the capacitor.
Restrictions in chip alignment do not apply to SOLDER REFLOW or VAPOR PHASE processes, where the solder volume is con-
trolled by the solder paste deposition on the circuit pads. Pads are designed to match or slightly exceed the width of the capac-
itor, with length .030” (.760 mm) greater than the chip terminal band width, to provide a wetting area for a full solder fillet.
7
RECOMMENDATIONS
Preheat/Cooling rates not to exceed 120°C/minute.
DT spikes to max temperature not to exceed 100°C
TEMPERA
TURE
°
C
250
225
200
175
150
125
100
75
50
20
40
60
80
100
120 140
160
180
200
SECONDS
SOLDER ATTACHMENT RECOMMENDED PROFILES
SOLDER WAVE
VAPOR PHASE
SOLDER REFLOW
NOVACAP
publishes
a
Technical Brochure which pro-
vides detailed information on the
properties
of
ceramic
chip
capacitors, dielectric behavior,
product classifications, test and
quality standards, and other
information relevant to their
use. The NOVACAP Technical
Brochure is available upon
request. For quick reference
see the Brochure on the
NOVACAP Website at
www.novacap.com.
相關(guān)PDF資料
PDF描述
0805B104xxx Multilayer Ceramic Chip Capacitors Products NPO, X7R, Y5V
0805CG101J9AB KONDENSATOR 100PF 50V 10ST
0805CG221J9AB KONDENSATOR 220PF 50V 10ST
0805CG471J9AB KONDENSATOR 470PF 50V 10ST
0805CS-020XJBB OBSOLETE when inventory is depleted. Change second to last letter to 'L' for new RoHS part number. Terminals never contained lead.
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
0805B104K500NT 功能描述:多層陶瓷電容器MLCC - SMD/SMT .10uF 50V RoHS:否 制造商:American Technical Ceramics (ATC) 電容:10 pF 容差:1 % 電壓額定值:250 V 溫度系數(shù)/代碼:C0G (NP0) 外殼代碼 - in:0505 外殼代碼 - mm:1414 工作溫度范圍:- 55 C to + 125 C 產(chǎn)品:Low ESR MLCCs 封裝:Reel
0805B104K500P 功能描述:CAP CER 制造商:knowles novacap 系列:- 包裝:剪切帶（CT） 零件狀態(tài):在售 電容:0.1μF 容差:±10% 電壓 - 額定:50V 溫度系數(shù):X7R 工作溫度:-55°C ~ 125°C 特性:環(huán)氧樹脂封裝 等級(jí):- 應(yīng)用:旁通，去耦 故障率:- 安裝類型:表面貼裝，MLCC 封裝/外殼:0805（2012 公制） 大小/尺寸:0.080" 長(zhǎng) x 0.050" 寬（2.03mm x 1.27mm） 高度 - 安裝（最大值）:- 厚度（最大值）:0.054"（1.37mm） 引線間距:- 引線形式:- 標(biāo)準(zhǔn)包裝:1
0805B105K100CT 制造商:Walsin Technology Corporation 功能描述: 制造商:Walsin Technology Corporation 功能描述:0805 X7R 1 uF 10 V 10 % Tolerance Surface Mount Multilayer Ceramic Capacitor 制造商:Walsin Technology Corporation 功能描述:0805 X7R 1 uF 10 V ?10 % Tolerance Surface Mount Multilayer Ceramic Capacitor
0805B105K160CT 制造商:Walsin Technology Corporation 功能描述:
0805B105K250CT 制造商:Walsin Technology Corporation 功能描述:
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