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參數(shù)資料
| 型號(hào)： | 05DD-8M |
| 廠商： | J S T MFG CO LTD |
| 元件分類： | 電路板相疊連接器 |
| 英文描述： | 5 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, PRESS FIT |
| 文件頁(yè)數(shù)： | 1/2頁(yè) |
| 文件大?。?/td> | 126K |
| 代理商： | 05DD-8M |
1
DD/DS CONNECTOR
2.0mm pitch/Board-in Insulation displacement connectors
The DD and DS right angle board-in
insulation displacement connectors
measure just 3.5mm in mounting height
and 4.3mm in width.
Since these right angle connectors are
connected to wires running parallel to the
printed circuit board, electronic equipment
can have a lower profile. These connectors
are suited for the high density wiring of
electronic products.
Compact and low profile
Twin U-slot insulation displacement section
Compliant locking solder tails
Strain relief
Specifications –––––––––––––––––––
Current rating:
0.7A AC, DC
Voltage rating:
100V AC, DC
Temperature range: -25C to +85C
(including temperature rise in applying
electrical current)
Insulation resistance:
1,000M
min.
Withstanding voltage:
800V AC/minute
Applicable wire: UL1571, 1061(Contact JST for diameters
regarding other UL styles.)
AWG #28
Conductor/7 strands, tin-coated
Insulation O.D./0.9mm
Applicable PC board thickness:
DD connector: 0.8, 1.0mm
DS connector: 1.2, 1.6mm
* Compliant with RoHS.
* Refer to "General Instruction and Notice when using
Terminals and Connectors" at the end of this catalog.
* Contact JST for details.
Standards ––––––––––––––––––––––
0 Recognized E60389
1CertifiedLR20812
PC board layout (viewed from soldering side) and Assembly layout
Note: 1. Tolerances are non-cumulative:
±0.05mm for all centers.
2. Hole dimensions differ according to the kind of PC board and piercing
method. The dimensions above should serve as a guideline.
Contact JST for details.
3. Pulling or otherwise putting a strain on the harness attached to the connector
before the solder has completely cooled can dislodge the connector or cause
its misalignment.
4. Do not reuse any connectors that were previously soldered to and then
removed from a PC board.
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