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參數(shù)資料
| 型號： | 055-F24-9019A9G |
| 廠商： | ITT Corporation |
| 英文描述： | 1.0/2.3 RF Connector Series |
| 中文描述： | 1.0/2.3射頻連接器系列 |
| 文件頁數(shù)： | 4/35頁 |
| 文件大?。?/td> | 3262K |
| 代理商： | 055-F24-9019A9G |
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RF Coaxial Connectors
www.ittcannon.com
Dimensions are shown in mm (inch)
Dimensions subject to change
12
MID 1.0/2.3
Description
Features
ITT Industries, Cannon can now offer a range of surface mount coaxial
connectors developed to suit the requirements of modern interconnect
systems. Currently being produced with the emerging standard, 1.0/
2.3 75W interface for telecommunication equipments, these new
connectors can be used in fully automated production processes.
Featuring the new MID plated plastic bodies, these new connectors are
constructed in modules comprising 2, 3 or 4 ports. The modules are
light in weight, enabling them to be handled by suction pick and place,
and because all PCB contact pads are formed as part of the moulding,
exceptional coplanarity can be assured.
The provision for additional mechanical fixing of the connector, through
the PCB by rivet or screw is included, which will increase the connector
to board retention. With this additional fixing, a total axial force of
150N per port can be applied.
2,3 or 4 port configurations
1.0/2.3 jack interface
Coplanarity of +/- 0.05mm
Flat top for suction pick-up
Light weight ( 2 port < 5g, 4 port < 13g)
Tape and reel packed
Resistant to normal soldering temperatures
Resistant to most PCB cleaning processes
Common Grounds
75 ohm nominal impedence
Interface to CECC 22230 & DIN 47247
Reflection factor: r = 0.1 up to 500 MHz
Inner contact resistance :<20m ohm
Outer contact resistance :<30m ohm
Proof voltage: 750 Vrms
Connector to board solder retention : 3N/mm
Specification
Soldering Temperature Profile
0
70
140
210
280
30
60
90
120
150
180
Process time - Seconds
Degrees
C
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