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參數(shù)資料
| 型號(hào)： | 0512484799 |
| 廠商： | MOLEX INC |
| 元件分類： | 插座 |
| 英文描述： | PGA479, IC SOCKET |
| 文件頁數(shù)： | 1/2頁 |
| 文件大小： | 32K |
| 代理商： | 0512484799 |
This document was generated on 11/04/2009
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
Active
Description:
1.27mm (.050") Pitch Micro PGA Socket for Mobile Pentium* 4, Ball Grid Array (BGA)
Mount, ZIF, 479 Circuits, with Pick and Place Cover, Tape and Reel Package, 0.25m
(10") Gold (Au) Plating, Lead Free
Documents:
General
Product Family
Processor Sockets
Series
Comments
ZIF, with Pick and Place Cover
Component Type
Socket
Product Name
Micro PGA
Physical
Circuits (Loaded)
479
Circuits (maximum)
479
Color - Resin
Black
Color - Resin
Natural
Durability (mating cycles max)
50
Material - Metal
Copper-Nickel-Silicon
Material - Metal
Stainless Steel
Material - Plating Mating
Gold
Material - Plating Termination
Nickel
Material - Resin
High Temperature Thermoplastic
Packaging Type
Embossed Tape on Reel
Pitch - Mating Interface (in)
0.050 In
Pitch - Mating Interface (mm)
1.27 mm
Plating min: Mating (in)
10.16
Plating min: Mating (m)
0.254
Plating min: Termination (in)
98
Plating min: Termination (m)
1.5
Temperature Range - Operating
-20°C to +90°C
Termination Interface: Style
Surface Mount
Electrical
Current - Maximum
0.5A
Voltage - Maximum
100V
Solder Process Data
Duration at Max. Process Temperature (seconds)
10
Lead-free Process Capability
Reflow Capable (SMT only)
Max. Cycles at Max. Process Temperature
1
Process Temperature max. C
250
Material Info
Reference - Drawing Numbers
Sales Drawing
SD-51248-015
Sales Drawing
SD-51248-016
* Pentium and Celeron are registered trademark of Intel Corporation
Series image - Reference only
ELV and RoHS
Compliant
Contains SVHC: No
Not Reviewed
Need more information on product
environmental compliance?
Please visit the Contact Us section for any
non-product compliance questions.
Search Parts in this Series
51248 Series
Mates With
Intel Mobile Celeron* Processor-M|Intel
Mobile Pentium* 4 Processor
This document was generated on 11/04/2009
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