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| 型號(hào)： | 021AL |
| 英文描述： | FEMTOCLOCKS-TM CRYSTAL-TO- 3.3V LVPECL CLOCK GENERATOR |
| 中文描述： | FEMTOCLOCKS -商標(biāo)晶體至3.3V的LVPECL時(shí)鐘發(fā)生器 |
| 文件頁(yè)數(shù)： | 12/13頁(yè) |
| 文件大?。?/td> | 189K |
| 代理商： | 021AL |
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843021AG
www.icst.com/products/hiperclocks.html
REV. C MARCH 31, 2005
8
Integrated
Circuit
Systems, Inc.
ICS843021
FEMTOCLOCKSCRYSTAL-TO-
3.3V LVPECL CLOCK GENERATOR
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS843021.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS843021 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
CC = 3.3V + 10% = 3.63V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX = VCC_MAX * IEE_MAX = 3.63V * 85mA = 308.6mW
Power (outputs)
MAX = 30mW/Loaded Output pair
Total Power
_MAX (3.63V, with all outputs switching) = 308.6mW + 30mW = 338.6mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockSTM devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming a
moderate air flow of 1 meter per second and a multi-layer board, the appropriate value is 90.5°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.339W * 90.5°C/W = 100.7°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
TABLE 6. THERMAL RESISTANCE
θθθθθ
JA
FOR
8-PIN TSSOP, FORCED CONVECTION
θθθθθ
JA by Velocity (Meters per Second)
0
1
2.5
Multi-Layer PCB, JEDEC Standard Test Boards
101.7°C/W
90.5°C/W
89.8°C/W
NOTE: Most modern PCB designs use multi-layered boards.
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| 021-B | 功能描述:罩類(lèi)、盒類(lèi)及殼類(lèi)產(chǎn)品 4.1 x 2.6 x 0.9 Black RoHS:否 制造商:Bud Industries 產(chǎn)品:Boxes 外部深度:6.35 mm 外部寬度:6.35 mm 外部高度:2.56 mm NEMA 額定值: IP 等級(jí): 材料:Acrylonitrile Butadiene Styrene (ABS) 顏色:Red |
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| 021-I ALMOND | 制造商:SERPAC Electronic Enclosures 功能描述:Enclosure; Plastic; 4.1 in. L x 2.610 in. W x 0.910 in. H; Almond |
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