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參數(shù)資料
| 型號： | 0-1462037-9 |
| 元件分類： | 射頻繼電器 |
| 英文描述： | RF RELAY, DPDT, MOMENTARY, 0.031A (COIL), 4.5VDC (COIL), 140mW (COIL), 2A (CONTACT), 30VDC (CONTACT), 900MHz, 60W (RF INPUT), SURFACE MOUNT-STRAIGHT |
| 文件頁數(shù)： | 10/11頁 |
| 文件大小： | 795K |
| 代理商： | 0-1462037-9 |
General data
Operate time at U
nom typ. / max.
Reset time (latching) at U
nom , typ. / max.
Release time without diode in parallel (non-latching), typ. / max.
Release time with diode in parallel (non-latching), typ. / max.
Bounce time at closing contact, typ. / max.
Maximum switching rate without load
Ambient temperature
Thermal resistance
Maximum permissible coil temperature
Vibration resistance (function)
Shock resistance, half sinus, 11 ms
half sinus, 0.5 ms
Degree of protection / Environmental protection
Needle flame test
Mounting position
Processing information
Weight (mass)
Terminal surface
Moisture sensitive level (JEDEC J-STD-020B)
Resistance to soldering heat
1 ms / 3 ms
1 ms /3 ms
1 ms / 3 ms
3 ms / 5 ms
1 ms / 5 ms
50 operations/s
-40° C ... +85° C
< 150 K/W
125° C
20 G
10 to 1000 Hz
50 G (function)
500 G (damage)
immersion cleanable, IP 67 / RT V
application time 20 s, no burning and glowing
any
Ultrasonic cleaning is not recommended
max. 0.75 g
NiPdAu
MSL 3
260° C / 10 s
IM Relay
All data refers to 23° C unless otherwise specified.
Page 8 (11)
108-98001 Rev. D
Recommended soldering conditions
Soldering conditions according IEC 60058-2-58 and
IPC/JEDEC J-STD-020B
Vapor Phase Soldering: Temperature/Time Profile
(Lead and Housing Peak Temperature)
Infrared Soldering: Temperature/Time Profile
(Lead and Housing Peak Temperature)
240° C
180° C
130° C
100° C
20 - 40 sec
Full line:
typical
Dotted line: process limits
forced
cooling
Time (s)
Temperature
°C
Temperature
°C
Time (s)
Resistance to soldering heat - Reflow profile
Recommended reflow soldering profile
Infrared Soldering: Temperature/Time Profile
(Lead and Housing Peak Temperature)
Temperature
°C
Time (s)
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