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參數(shù)資料
| 型號： | μPG173TA |
| 廠商： | NEC Corp. |
| 英文描述： | L-Band PA Driver Amplifier(L波段PA驅(qū)動(dòng)放大器) |
| 中文描述： | L波段功率放大器驅(qū)動(dòng)放大器（長波段功率放大器驅(qū)動(dòng)放大器） |
| 文件頁數(shù)： | 5/8頁 |
| 文件大?。?/td> | 86K |
| 代理商： | ΜPG173TA |
Preliminary Data Sheet
5
P
PG173TA
RECOMMENDED SOLDERING CONDITIONS
This Product should be soldered in the following recommended conditions. Other soldering methods and
conditions than the recommended conditions are to be consulted with our sales representatives.
Soldering process
Soldering conditions
Recommended condition
symbol
Infrared ray reflow
Package peak temperature: 235°C
Hour: within 30 s. (more than 210°C)
Time: 3 times, Limited days: no.
Note
IR35-00-3
VPS
Package peak temperature: 215°C
Hour: within 40 s. (more than 200°C)
Time: 3 times, Limited days: no.
Note
VP15-00-3
Wave Soldering
Soldering tub temperature: less than 260°C, Hour: within 10 s.
Time: 1 time, Limited days: no.
Note
WS60-00-1
Pin part heating
Pin area temperature: less than 300°C, Hour: within 3 s.
Limited days: no.
Note
Note
It is the storage days after opening a dry pack, the storage conditions are 25°C, less than 65%, RH.
Caution The combined use of soldering method is to be avoided (However, except the pin area heating
method).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
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