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參數(shù)資料
| 型號： | μPD789024 |
| 廠商： | NEC Corp. |
| 英文描述： | 8 Bit Single Chip Microcontrollers(8位單片微控制器) |
| 中文描述： | 8位單片機微控制器（8位單片微控制器） |
| 文件頁數(shù)： | 44/52頁 |
| 文件大小： | 275K |
| 代理商： | ΜPD789024 |
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44
μ
PD789022, 789024, 789025, 789026
13. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD789025 and
μ
PD789026 should be soldered and mounted under the conditions recommended in the
table below.
For detail of recommended soldering conditions, refer to the information document
SMD Surface Mount
Technology Manual
(C10535E).
For soldering methods and conditions other than those recommended below, contact our sales representatives.
Caution
The
μ
PD789022 and
μ
PD789024 are under development; their soldering conditions are to be
determined.
Table 13-1. Surface Mounting Type Soldering Conditions
μ
PD789025GB-
μ
PD789026GB-
×××
-3BS-MTX: 44-pin plastic QFP (10
×
10 mm)
×××
-3BS-MTX: 44-pin plastic QFP (10
×
10 mm)
Soldering method
Soldering conditions
Recommended
condition symbol
Infrared reflow
Package peak temperature: 235 °C
Duration: 30 sec. max. (at 210 °C or above)
Maximum allowable number of reflow processes: 3
IR35-00-3
VPS
Package peak temperature: 215 °C
Duration: 40 sec. max. (at 200 °C or above)
Maximum allowable number of reflow processes: 3
VP15-00-3
Wave soldering
Solder bath temperature: 260 °C max.
Duration: 10 sec. max.
Number of times: Once
Preliminary heat temperature: 120 °C max. (Package surface temperature)
WS60-00-1
Partial heating
method
Terminal temperature: 300 °C max. Duration: 3 sec. max. (per device
side)
-
Caution
Use of more than one soldering method should be avoided (except for partial heating method).
Table 13-2. Insertion Type Soldering Conditions
μ
PD789025CU-
μ
PD789026CU-
×××
:
×××
:
42-pin plastic shrink DIP (600 mil)
42-pin plastic shrink DIP (600 mil)
Soldering method
Soldering conditions
Wave soldering (terminal only)
Solder bath temperature: 260 °C max., Duration: 10 sec. max.
Partial heating method
Terminal temperature: 300 °C max., Duration: 3 sec. max. (for each pin)
Caution
Apply wave soldering to terminals only. See to it that the jet solder does not contact with the
chip directly.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| μPD789025 | 8 Bit Single Chip Microcontrollers(8位單片微控制器) |
| μPD789026 | 8 Bit Single Chip Microcontrollers(8位單片微控制器) |
| μPD789022 | 8 Bit Single Chip Microcontrollers |
| μPD789104CT | 8 Bit Gerneral-Purpose Microcontrollers(8 位通用微控制器) |
| μPD789102CT | 8 Bit Gerneral-Purpose Microcontrollers(8 位通用微控制器) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PD78F0134 | 制造商:NEC 制造商全稱:NEC 功能描述:8-Bit Single-Chip Microcontrollers |
| PD78F0134(A) | 制造商:NEC 制造商全稱:NEC 功能描述:8-Bit Single-Chip Microcontrollers |
| PD78F0134(A1) | 制造商:NEC 制造商全稱:NEC 功能描述:8-Bit Single-Chip Microcontrollers |
| PD78F0134A | 制造商:NEC 制造商全稱:NEC 功能描述:8-Bit Single-Chip Microcontrollers |
| PD78F0134A1 | 制造商:NEC 制造商全稱:NEC 功能描述:8-Bit Single-Chip Microcontrollers |
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