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參數(shù)資料
| 型號(hào)： | μPD789012 |
| 廠商： | NEC Corp. |
| 英文描述： | 8 Bit Single Chip Microcontrollers(8位單片微控制器) |
| 中文描述： | 8位單片機(jī)微控制器（8位單片微控制器） |
| 文件頁數(shù)： | 39/44頁 |
| 文件大?。?/td> | 271K |
| 代理商： | ΜPD789012 |
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μ
PD789011, 789012
39
12. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD789011 and 789012 should be soldered and mounted under the conditions recommended in the table
below.
For detail of recommended soldering conditions, refer to the information document
Semiconductor Device
Mounting Technology Manual
(C10535E).
For soldering methods and conditions other than those recommended below, contact an NEC sales representative.
Table 12-1. Soldering Conditions for Surface-mount Devices
μ
PD789011GT-
×××
: 28-pin Plastic SOP (375 mil)
μ
PD789012GT-
×××
: 28-pin Plastic SOP (375 mil)
Recommended
Condition Code
Soldering Method
Soldering Conditions
Infrared reflow
Package peak temperature: 235
°
C, Duration: 30 seconds max. (at 210
°
C or above)
Number of times: two times max.
VPS
Package peak temperature: 215
°
C, Duration: 40 seconds max. (at 200
°
C or above)
Number of times: two times max.
Wave soldering
Soldering bath temperature: 260
°
C max., Duration: 10 seconds max., Number of
times: Once
Preheating temperature: 120
°
C max.(Package surface temperature)
Partial heating
Pin temperature: 300
°
C max., Duration: 3 seconds max. (per device side)
Note
The storage conditions are 25
°
C and 65% RH for the number of storage days after opening the seal of the
dry pack.
Caution
Using more than one soldering method should be avoided. (except in the case of partial heating)
Table 12-2. Soldering Conditions for Through-hole Devices
μ
PD789011CT-
×××
: 28-pin Plastic Shrink DIP (400 mil)
μ
PD789012CT-
×××
: 28-pin Plastic Shrink DIP (400 mil)
Soldering Method
Soldering Conditions
Wave soldering (pin only)
Solder bath temperature: 260
°
C max., Duration: 10 seconds max.
Partial heating
Pin temperature: 300
°
C max., Duration: 3 seconds max.(per pin)
Caution
Wave soldering is only for the lead part in order that jet solder cannot contact with the chip
directly.
IR35-00-2
VP15-00-2
WS60-00-1
—
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