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參數(shù)資料
| 型號： | μPD784215 |
| 廠商： | NEC Corp. |
| 英文描述： | 8/16 Bit Single Chip Microcontrollers(8/16 位單片微控制器) |
| 中文描述： | 8 / 16位單片機微控制器（8 / 16位單片微控制器） |
| 文件頁數(shù)： | 80/88頁 |
| 文件大小： | 427K |
| 代理商： | ΜPD784215 |
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μ
PD784214,784215,784216
80
15. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD784216 should be soldered and mounted under the following recommended conditions. For the details
of the recommended soldering conditions, refer to the document
Semiconductor Device Mounting Technology
Manual (C10535E)
. For soldering methods and conditions other than those recommended below, contact your NEC
sales representative.
Table 15-1. Soldering Conditions for Surface Mount Type
(1)
μ
PD784214GC-
×××
-8EU: 100-pin plastic LQFP (Fine pitch) (14
×
14 mm)
μ
PD784215GC-
×××
-8EU: 100-pin plastic LQFP (Fine pitch) (14
×
14 mm)
μ
PD784216GC-
×××
-8EU: 100-pin plastic LQFP (Fine pitch) (14
×
14 mm)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 sec. Max. (at 210
°
C or higher),
Count: two times or less
IR35-00-2
VPS
Package peak temperature: 215
°
C, Time: 40 sec. Max. (at 200
°
C or higher),
Count: two times or less
VP-15-00-2
Partial heating
Pin temperature: 300
°
C Max., Time: 3 sec. Max. (per pin row)
—
Caution
Do not use different soldering methods together (except for partial heating).
(2)
μ
PD784214GF-
×××
-3BA: 100-pin plastic QFP (Fine pitch) (14
×
20 mm)
μ
PD784215GF-
×××
-3BA: 100-pin plastic QFP (Fine pitch) (14
×
20 mm)
μ
PD784216GF-
×××
-3BA: 100-pin plastic QFP (Fine pitch) (14
×
20 mm)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 sec. Max. (at 210
°
C or higher),
Count: two times or less
IR35-00-2
VPS
Package peak temperature: 215
°
C, Time: 40 sec. Max. (at 200
°
C or higher),
Count: two times or less
VP15-00-2
Wave soldering
Solder bath temperature: 260
°
C Max., Time: 10 sec. Max., Count: once,
Preheating temperature: 120
°
C Max. (package surface temperature)
WS60-00-1
Partial heating
Pin temperature: 300
°
C Max., Time: 3 sec. Max. (per pin row)
—
Caution
Do not use different soldering methods together (except for partial heating).
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| μPD784216Y | 8/16 Bit Single Chip Microcontrollers(8/16位單片微控制器) |
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| μPD784218Y | 8 /16 Bit Single Chip Microcontrollers(8/16位單片微控制器) |
| μPD784218 | 8 /16 Bit Single Chip Microcontrollers(8/16位單片微控制器) |
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