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參數(shù)資料
| 型號(hào)： | μPD78078Y |
| 廠商： | NEC Corp. |
| 元件分類(lèi)： | 8位微控制器 |
| 英文描述： | 8 Bit Single Chip Microcontrollers |
| 中文描述： | 8位單片機(jī)微控制器 |
| 文件頁(yè)數(shù)： | 74/84頁(yè) |
| 文件大?。?/td> | 625K |
| 代理商： | ΜPD78078Y |
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74
μ
PD78076Y, 78078Y
14. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD78076Y and 78078Y should be soldered and mounted under the conditions recommended in the table
below.
For detail of recommended soldering conditions, refer to the information document
Semiconductor Device
Mounting Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, consult an NEC sales personnel.
Table 14-1. Surface Mounting Type Soldering Conditions
Package peak temperature: 235
°
C, Duration: 30 sec. max. (at 210
°
C or above),
Number of times: three or less.
Package peak temperature: 215
°
C, Duration: 40 sec. max. (at 200
°
C or above),
Number of times: three or less.
Soldering bath temperature: 260
°
C max., Duration: 10 sec. max., Number of times:
once, Preheating temperature: 120
°
C max. (package surface temperature)
Pin temperature: 300
°
C max. Duration: 3 sec. max. (per pin row)
Soldering Conditions
Soldering
Method
μ
PD78076YGF-
×××
-3BA :
μ
PD78078YGF-
×××
-3BA :
100-pin plastic QFP (14
×
20 mm, resin thickness 2.7 mm)
100-pin plastic QFP (14
×
20 mm, resin thickness 2.7 mm)
Recommended
Condition Symbol
IR35-00-3
Infrared reflow
VPS
Wave
soldering
Partial heating
VP15-00-3
WS60-00-1
—
Cautions 1. Use of more than one soldering method should be avoided (except in the case of partial heating).
2. The soldering conditions for the
μ
PD78076YGC-xxx-8EU and
μ
PD78078YGC-xxx-8EU are
undefined, since they are still under development.
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