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參數(shù)資料
| 型號： | μPD78070A |
| 廠商： | NEC Corp. |
| 英文描述： | 8 Bit Single Chip Microcontrollers(8位單片微控制器) |
| 中文描述： | 8位單片機微控制器（8位單片微控制器） |
| 文件頁數(shù)： | 66/74頁 |
| 文件大小： | 481K |
| 代理商： | ΜPD78070A |
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m
PD78070A
65
13. RECOMMENDED SOLDERING CONDITIONS
It is recommended that the
m
PD78070A be soldered under the following conditions.
For details on the recommended soldering conditions, refer to information document
"Semiconductor Device Mounting
Technology Manual" (C10535E)
.
For soldering methods and conditions other than those recommended, please contact your NEC sales representative.
Table 13-1. Soldering Conditions for Surface Mount Devices (1/2)
(1)
m
PD78070AGC-7EA: 100-pin plastic QFP (Fine pitch) (14
￥
14 mm, resin thickness 1.45 mm)
Soldering Method
Soldering Conditions
Symbol
Infrared ray reflow
Package peak temperature: 235 °C, Reflow time: 30 seconds or less (at 210 °C
IR35-107-2
or higher), Number of reflow processes: 2 or less, Exposure limit: 7 days
Note
(10 hours pre-baking is required at 125 °C afterwards)
< Cautions >
(1)
Wait for the device temperature to return to normal after the first reflow
before starting the second reflow.
(2)
Do not perform flux cleaning with water after the first reflow.
VPS
Package peak temperature: 215 °C, Reflow time: 40 seconds or less (at 200 °C
VP15-107-2
or higher), Number of reflow processes: 2 or less, Exposure limit: 7 days
Note
(10 hours pre-baking is required at 125 °C afterwards)
< Cautions >
(1)
Wait for the device temperature to return to normal after the first reflow
before starting the second reflow.
(2)
Do not perform flux cleaning with water after the first reflow.
Partial heating
Pin temperature: 300°C or below, Flow time: 3 seconds or less (per device side)
—
Note
Exposure limit before soldering after the dry pack package is opened. Storage conditions: 25 °C and relative
humidity at 65% or less.
Caution
Do not use different soldering methods together (except for partial heating method).
#
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