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參數(shù)資料
| 型號(hào)： | μPD78064B(A) |
| 廠商： | NEC Corp. |
| 元件分類： | 8位微控制器 |
| 英文描述： | 8 Bit Single Chip Microcontrollers |
| 中文描述： | 8位單片機(jī)微控制器 |
| 文件頁(yè)數(shù)： | 59/66頁(yè) |
| 文件大?。?/td> | 395K |
| 代理商： | ΜPD78064B(A) |
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59
μ
PD78064B(A)
12. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD78064B(A) should be soldered and mounted under the conditions recommended in the table below.
For details of recommended soldering conditions, refer to the information document
Semiconductor Device
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact an NEC sales representative.
Table 12-1. Surface Mounting Type Soldering Conditions
(1)
μ
PD78064BGC(A)-
×××
-7EA : 100-pin plastic QFP (Fine pitch) (14
×
14 mm)
Soldering Method
Soldering Conditions
Symbol
Package peak temperature: 235
°
C, Duration: 30 sec. max. (at 210
°
C or above),
Number of times: Twice max., Time limit: 7 days
Note
(thereafter 10 hours prebaking
required at 125
°
C)
Package peak temperature: 215
°
C, Duration: 40 sec. max. (at 200
°
C or above),
Number of times: Twice max., Time limit: 7 days
Note
(thereafter 10 hours prebaking
required at 125
°
C)
Pin temperature: 300
°
C max. Duration: 3 sec. max. (per pin row)
Infrared reflow
VPS
Partial heating
IR35-107-2
VP15-107-2
—
(2)
μ
PD78064BGF(A)-
×××
-3BA : 100-pin plastic QFP (14
×
20 mm)
Soldering Method
Soldering Conditions
Symbol
Package peak temperature: 235
°
C, Duration: 30 sec. max. (at 210
°
C or above),
Number of times: 3 times max.
Package peak temperature: 215
°
C, Duration: 40 sec. max. (at 200
°
C or above),
Number of times: 3 times max.
Solder bath temperature: 260
°
C max., Duration: 10 sec. max., Number of times: Once,
Preliminary heat temperature: 120
°
C max. (Package surface temperature)
Pin temperature: 300
°
C max. Duration: 3 sec. max. (per pin row)
Infrared reflow
VPS
Wave soldering
Partial heating
IR35-00-3
VP15-00-3
WS60-00-1
—
Note
For the storage period after dry-pack decapsulation, storage conditions are max. 25
°
C, 65% RH.
Cautions
1.
Use of more than one soldering method should be avoided (except in the case of partial
heating).
Because the
μ
PD78064BGC(A)-xxx-8EU is under development, its soldering condition is not
defined.
2.
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