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參數(shù)資料
| 型號： | μPD78018F |
| 廠商： | NEC Corp. |
| 元件分類： | 8位微控制器 |
| 英文描述： | 8 Bit Single Chip Microcontrollers |
| 中文描述： | 8位單片機微控制器 |
| 文件頁數(shù)： | 66/74頁 |
| 文件大?。?/td> | 567K |
| 代理商： | ΜPD78018F |
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66
μ
PD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Table 14-1. Surface Mounting Type Soldering Conditions (2/2)
(2)
μ
PD78011FGK-
×××
-8A8 : 64-Pin Plastic LQFP (12
×
12 mm)
μ
PD78012FGK-
×××
-8A8 : 64-Pin Plastic LQFP (12
×
12 mm)
μ
PD78013FGK-
×××
-8A8 : 64-Pin Plastic LQFP (12
×
12 mm)
μ
PD78014FGK-
×××
-8A8 : 64-Pin Plastic LQFP (12
×
12 mm)
μ
PD78015FGK-
×××
-8A8 : 64-Pin Plastic LQFP (12
×
12 mm)
μ
PD78016FGK-
×××
-8A8 : 64-Pin Plastic LQFP (12
×
12 mm)
μ
PD78018FGK-
×××
-8A8 : 64-Pin Plastic LQFP (12
×
12 mm)
Recommended
Condition Symbol
Soldering Method
Soldering Conditions
Infrared reflow
VPS
Wave soldering
Partial heating
Package peak temperature: 235
°
C, Duration: 30 sec. max. (at 210
°
C or above),
Number of times: Twice max., Number of days: 7 days
Note
(after that, 125
°
C prebaking
for 10 hours is necessary.)
<
Precautions
>
(1) Start the second reflow after the device temprature by the first reflow returns to
normal.
(2) Flux washing by the water after the first reflow should be avoided.
Package peak temperature: 215
°
C, Duration: 40 sec. max. (at 200
°
C or above),
Number of times: Twice max., Number of days: 7 days
Note
(after that, 125
°
C prebaking
for 10 hours is necessary.)
<
Precautions
>
(1) Start the second reflow after the device temprature by the first reflow returns to
normal.
(2) Flux washing by the water after the first reflow should be avoided.
Solder bath temperature: 260
°
C max. Duration: 10 sec. max.
Number of times: Once, Preheating temperature: 120
°
C max. (Package surface
temperature), Number of days: 7 days
Note
(after that, 125
°
C prebaking for 10 hours is
necessary.)
Pin temperature: 300
°
C max., Duration: 3 sec. max. (per device side)
IR35-107-2
VP15-107-2
WS60-107-1
—
Note
The number of days the device can be stored at 25
°
C, 65% RH MAX. after the dry pack has been opend.
Caution
Use more than one soldering method should be avoided (except in the case of partial heating).
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