
65
μ
PD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
14. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD78011F/78012F/78013F/78014F/78015F/78016F/78018F should be soldered and mounted under the condi-
tions recommended in the table below.
For detail of recommended soldering conditions, refer to the information document
Semiconductor Device
Mounting Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact our salespersonnel.
Table 14-1. Surface Mounting Type Soldering Conditions (1/2)
(1)
μ
PD78011FGC-
×××
-AB8: 64-Pin Plastic QFP (14
×
14 mm)
μ
PD78012FGC-
×××
-AB8: 64-Pin Plastic QFP (14
×
14 mm)
μ
PD78013FGC-
×××
-AB8: 64-Pin Plastic QFP (14
×
14 mm)
μ
PD78014FGC-
×××
-AB8: 64-Pin Plastic QFP (14
×
14 mm)
μ
PD78015FGC-
×××
-AB8: 64-Pin Plastic QFP (14
×
14 mm)
μ
PD78016FGC-
×××
-AB8: 64-Pin Plastic QFP (14
×
14 mm)
μ
PD78018FGC-
×××
-AB8: 64-Pin Plastic QFP (14
×
14 mm)
Recommended
Condition Symbol
Soldering Method
Soldering Conditions
Infrared reflow
VPS
Wave soldering
Partial heating
Package peak temperature: 235
°
C, Duration: 30 sec. max. (at 210
°
C or above),
Number of times: Three times max.
Package peak temperature: 215
°
C, Duration: 40 sec. max. (at 200
°
C or above),
Number of times: Three times max.
Solder bath temperature: 260
°
C max. Duration: 10 sec. max.
Number of times: Once
Preheating temperature: 120
°
C max. (Package surface temperature)
Pin temperature: 300
°
C max., Duration: 3 sec. max. (per device side)
IR35-00-3
VP15-00-3
WS60-00-1
—
Caution
Use more than one soldering method should be avoided (except in the case of partial heating).