參數(shù)資料
型號(hào)： μPD754244
廠商： NEC Corp.
英文描述： 4 Bit Single Chip Microcontrollers(4位單片微控制器)
中文描述： 4位單片微控制器（4位單片微控制器）
文件頁(yè)數(shù)： 78/88頁(yè)
文件大?。?/td> 417K
代理商： ΜPD754244
78
μ
PD754144, 754244
17. RECOMMENDED SOLDERING CONDITIONS
Solder the
μ
PD754244 under the following recommended conditions.
For the details on the recommended soldering conditions, refer to Information Document
“Semiconductor
Device Mounting Technology Manual (C10535E)”
.
For the soldering method and conditions other than those recommended, consult an NEC representative.
Table 17-1. Soldering Conditions of Surface Mount Type (1/2)
(1)
μ
PD754244GS-xxx-GJG: 20-pin plastic shrink SOP (300 mil, 0.65-mm pitch)
Soldering Method
Soldering Conditions
Symbol
Infrared ray reflow
Package peak temperature: 235
°
C, Reflow time: 30 seconds max. (210
°
C min.),
IR35-00-2
Number of reflow process: 2 max.
VPS
Package peak temperature: 215
°
C, Reflow time: 40 seconds max. (200
°
C min.),
VP15-00-2
Number of reflow process: 2 max.
Wave soldering
Solder bath temperature: 260
°
C max., Flow time: 10 seconds max.,
WS60-00-1
Number of flow process: 1
Preheating temperature: 120
°
C max. (package surface temperature)
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per side of device)
–
Caution
Do not use different soldering methods together (except for partial heating).
(2)
μ
PD754144GS-xxx-GJG: 20-pin plastic shrink SOP (300 mil, 0.65-mm pitch)
Soldering Method
Soldering Conditions
Symbol
Infrared ray reflow
Package peak temperature: 235
°
C, Reflow time: 30 seconds max. (210
°
C min.),
IR35-00-3
Number of reflow process: 3 max.
VPS
Package peak temperature: 215
°
C, Reflow time: 40 seconds max. (200
°
C min.),
VP15-00-3
Number of reflow process: 3 max.
Wave soldering
Solder bath temperature: 260
°
C max., Flow time: 10 seconds max.,
WS60-00-1
Number of flow process: 1
Preheating temperature: 120
°
C max. (package surface temperature)
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per side of device)
–
Caution
Do not use different soldering methods together (except for partial heating).
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