參數(shù)資料
型號(hào)： μPD753208
廠商： NEC Corp.
英文描述： 4 Bit Single Chip Microcontrollers(4位單片微控制器)
中文描述： 4位單片微控制器（4位單片微控制器）
文件頁(yè)數(shù)： 3/80頁(yè)
文件大?。?/td> 513K
代理商： ΜPD753208
3
m
PD753204, 753206, 753208
CONTENTS
1.
PIN CONFIGURATION (TOP VIEW)................................................................................................... 5
2.
BLOCK DIAGRAM .............................................................................................................................. 6
3. PIN FUNCTIONS .................................................................................................................................. 7
3.1
Port Pins .................................................................................................................................... 7
3.2
Non-Port Pins ............................................................................................................................ 9
3.3
Pin Input/Output Circuits........................................................................................................ 11
3.4
Recommended Connections for Unused Pins...................................................................... 13
4.
SWITCHING FUNCTION BETWEEN Mk I MODE AND Mk II MODE ............................................... 14
4.1
Difference Between Mk I and Mk II Modes ............................................................................ 14
4.2
Setting Method of Stack Bank Select Register (SBS) .......................................................... 15
5.
MEMORY CONFIGURATION ........................................................................................................... 16
6.
PERIPHERAL HARDWARE FUNCTION .......................................................................................... 21
6.1
Digital I/O Port ......................................................................................................................... 21
6.2
Clock Generator ...................................................................................................................... 22
6.3
Clock Output Circuit ............................................................................................................... 23
6.4
Basic Interval Timer/Watchdog Timer ................................................................................... 24
6.5
Watch Timer............................................................................................................................. 25
6.6
Timer/Event Counter ............................................................................................................... 26
6.7
Serial Interface......................................................................................................................... 30
6.8
LCD Controller/Driver ............................................................................................................. 32
6.9
Bit Sequential Buffer............................................................................................................... 34
7.
INTERRUPT FUNCTION AND TEST FUNCTION............................................................................. 35
8.
STANDBY FUNCTION ...................................................................................................................... 37
9.
RESET FUNCTION ........................................................................................................................... 38
10. MASK OPTION.................................................................................................................................. 41
11. INSTRUCTION SET .......................................................................................................................... 42
12. ELECTRICAL SPECIFICATIONS ..................................................................................................... 56
13. CHARACTERISTIC CURVES (REFERENCE VALUES) .................................................................. 68
14. PACKAGE DRAWINGS.................................................................................................................... 70
15. RECOMMENDED SOLDERING CONDITIONS ................................................................................ 71
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