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參數(shù)資料
| 型號： | μPD23C24020 |
| 廠商： | NEC Corp. |
| 英文描述： | 24M-Bit Mask Programmable ROM(24M位掩膜可選ROM) |
| 中文描述： | 24M服務(wù)位掩?？删幊蘎OM（24米位掩膜可選光盤） |
| 文件頁數(shù)： | 10/12頁 |
| 文件大?。?/td> | 72K |
| 代理商： | ΜPD23C24020 |
10
μ
PD23C24020
Recommended Soldering Conditions
The following conditions (see table below) must be met when soldering the
μ
PD23C24020.
For more details, refer to our document "
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL
"
(C10535E)
.
Please consult with our sales offices in case other soldering process is used, or in case soldering is done under
different conditions.
Type of Through Hole Mount Device
μ
PD23C24020CZ : 42-pin plastic DIP (600 mil)
Soldering process
Soldering conditions
Wave soldering
(Only to leads)
Solder temperature : 260 °C or below,
Flow time : 10 seconds or below
Partial heating method
Terminal temperature : 300 °C or below,
Time : 3 seconds or below (Per one lead)
Caution Do not jet molten solder on the surface of package.
#
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