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參數(shù)資料
| 型號(hào)： | μPD23C16040A |
| 廠商： | NEC Corp. |
| 英文描述： | 16M-Bit Mask-Programmable ROM(16M 掩膜可編程ROM) |
| 中文描述： | 1,600位掩模可編程ROM（1,600掩膜可編程光盤） |
| 文件頁數(shù)： | 21/24頁 |
| 文件大小： | 180K |
| 代理商： | ΜPD23C16040A |
μ
PD23C16040A
21
Recommended Soldering Conditions
The following conditions (see table below) must be met when soldering the
μ
PD23C16040A.
For more details, refer to our document
“SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
(C10535E)
.
Please consult with our sales offices in case other soldering process is used, or in case soldering is done under
different conditions.
Types of Surface Mount Device
μ
PD23C16040AGX
μ
PD23C16040AGY-MJH : 48-pin Plastic TSOP (I) (12
×
18 mm) (Normal bent)
μ
PD23C16040AGY-MKH : 48-pin Plastic TSOP (I) (12
×
18 mm) (Reverse bent)
μ
PD23C16040AG5-7JF
: 44-pin Plastic TSOP (II) (400 mil) (Normal bent)
: 44-pin Plastic SOP (600 mil)
Please consult with our sales offices.
Type of Through Hole Mount Device
μ
PD23C16040ACZ
: 42-pin Plastic DIP (600 mil)
Soldering process
Soldering conditions
Wave soldering
(Only to leads)
Solder temperature: 260 C or below,
Flow time: 10 seconds or below
Partial heating method
Terminal temperature: 300 C or below,
Time: 3 seconds or below (Per one lead)
Caution Do not jet molten solder on the surface of package.
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