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參數(shù)資料
| 型號(hào)： | μPC8163TB |
| 廠商： | NEC Corp. |
| 英文描述： | Silicon MMIC 2.0 GHz Frequency Up-Converter(下變頻轉(zhuǎn)換器芯片) |
| 中文描述： | 硅單片2.0 GHz的頻率上轉(zhuǎn)換器（下變頻轉(zhuǎn)換器芯片） |
| 文件頁(yè)數(shù)： | 15/16頁(yè) |
| 文件大小： | 133K |
| 代理商： | ΜPC8163TB |
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Data Sheet P13636EJ2V0DS00
15
μ
PC8163TB
NOTE ON CORRECT USE
(1) Observe precautions for handling because of electrostatic sensitive devices.
(2) Form a ground pattern as wide as possible to keep the minimum ground impedance (to prevent undesired
oscillation).
(3) Keep the track length of the ground pins as short as possible.
(4) Connect a bypass capacitor (example: 1 000 pF) to the V
CC
pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your NEC sales representative.
Soldering Method
Soldering Conditions
Recommended Condition Symbol
Infrared Reflow
Package peak temperature: 235 °C or below
Time: 30 seconds or less (at 210 °C)
Count: 3, Exposure limit: None
Note
IR35-00-3
VPS
Package peak temperature: 215 °C or below
Time: 40 seconds or less (at 200 °C)
Count: 3, Exposure limit: None
Note
VP15-00-3
Wave Soldering
Soldering bath temperature: 260 °C or below
Time: 10 seconds or less
Count: 1, Exposure limit: None
Note
WS60-00-1
Partial Heating
Pin temperature: 300 °C
Time: 3 seconds or less (per side of device)
Exposure limit: None
Note
–
Note
After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period.
Caution
Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
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