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參數(shù)資料
| 型號： | μPC8128TB |
| 廠商： | NEC Corp. |
| 英文描述： | S ilicon MMIC Low Current Amplifiers(小電流放大器微波集成電路) |
| 中文描述： | 擰ilicon MMIC低電流放大器（小電流放大器微波集成電路） |
| 文件頁數(shù)： | 51/52頁 |
| 文件大?。?/td> | 259K |
| 代理商： | ΜPC8128TB |
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51
μ
PC8128TB,
μ
PC8151TB,
μ
PC8152TB
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to V
CC
line.
(4) The inductor (L) should be attached between output and V
CC
pins. The L and series capacitor (C2) values
should be adjusted for applied frequency to match impedance to next stage.
(5) The DC capacitor must be attached to input pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods and
conditions than the recommended conditions are to be consulted with our sales representatives.
μ
PC8128TB,
μ
PC8151TB,
μ
PC8152TB
Soldering method
Soldering conditions
Recommended condition symbol
Infrared ray reflow
Package peak temperature: 235 °C
Hour: within 30 s. (more than 210 °C)
Time: 3 times, Limited days: no.
Note
IR35-00-3
VPS
Package peak temperature: 215 °C
Hour: within 40 s. (more than 200 °C)
Time: 3 times, Limited days: no.
Note
VP15-00-3
Wave soldering
Soldering tub temperature: less than 260 °C, Hour: within 10 s.
Time: 1 time, Limited days: no.
Note
WS60-00-1
Pin part heating
Pin area temperature: 300 °C, Hour: within 3 s/pin.
Limited days: no.
Note
Note
It is the storage days after opening a dry pack, the storage conditions are 25 °C, less than 65 % RH.
Caution
The combined use of soldering method is to be avoided (However, except the pin area heating method).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E)
.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| μPC8151TB | S ilicon MMIC Low Current Amplifiers(小電流放大器微波集成電路) |
| μPC8152TB | S ilicon MMIC Low Current Amplifiers(小電流放大器微波集成電路) |
| μPC8129GR | Silicon MMIC Frequency DownConverter(下變頻轉(zhuǎn)換器芯片) |
| μPC8131TA | Variable Gain Amplifier.(可變增益放大器) |
| μPC8130TA | Variable Gain Amplifier.(可變增益放大器) |
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| PC812C | 制造商:SHARP 制造商全稱:Sharp Electrionic Components 功能描述:High Noise Resistance Type Photocoupler |
| PC812X1NIPJF | 制造商:Sharp Microelectronics Corporation 功能描述: |
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