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參數(shù)資料
| 型號： | μPC8116GR |
| 廠商： | NEC Corp. |
| 英文描述： | 500 MHz, AM/ASK RECEIVER IC(500 MHz AM/ASK受發(fā)器芯片) |
| 中文描述： | 500兆赫，調(diào)幅/ ASK接收器集成電路（500兆赫上午/賣出受發(fā)器芯片） |
| 文件頁數(shù)： | 13/16頁 |
| 文件大?。?/td> | 124K |
| 代理商： | ΜPC8116GR |
Preliminary Data Sheet P12361EJ2V0DS00
13
μ
PC8116GR
RECOMMENDED SOLDERING CONDITIONS
The following conditions (see table below) must be met when soldering this product.
Please consult with our sales officers in case other soldering process is used or in case soldering is done under
different conditions.
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
μ
PC8116GR
Soldering process
Soldering conditions
Symbol
Infrared ray reflow
Peak package’s surface temperature: 235
°
C or below,
Reflow time: 30 seconds or below (210
°
C or higher),
Number of reflow process: 3, Exposure limit
Note
: None
IR35-00-3
VPS
Peak package’s surface temperature: 215
°
C or below,
Reflow time: 40 seconds or below (200
°
C or higher),
Number of reflow process: 3, Exposure limit
Note
: None
VP15-00-3
Wave soldering
Solder temperature: 260
°
C or below,
Reflow time: 10 seconds or below,
Number of reflow process: 1, Exposure limit
Note
: None
WS60-00-1
Partial heating method
Terminal temperature: 300
°
C or below,
Flow time: 3 seconds or below,
Exposure limit
Note
: None
Note
Exposure limit before soldering after dry-pack package is opened.
Storage conditions: 25
°
C and relative humidity at 65 % or less.
Caution
Do not apply more than single process at once, except for “Partial heating method”.
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