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參數資料
| 型號： | μPC8112TB |
| 廠商： | NEC Corp. |
| 英文描述： | Silicon MMIC Frequency DownConverter(下變頻轉換器芯片) |
| 中文描述： | 硅單片頻率下變頻（下變頻轉換器芯片） |
| 文件頁數： | 9/12頁 |
| 文件大小： | 107K |
| 代理商： | ΜPC8112TB |
Preliminary Data Sheet
9
μ
PC8112TB
NOTE ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation).
(3) Keep the track length of the ground pins as short as possible.
(4) The bypass capacitor (e.g. 1 000 pF) should be attached to the V
CC
pin.
(5) The matching circuit should be externally attached to the IF output pin.
(6) The DC cut capacitor must be each attached to the input and output pins.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your NEC sales representative.
μ
PC8112TB
Soldering Method
Soldering Conditions
Recommended Condition
Symbol
Infrared Reflow
Package peak temperature: 235 °C or below
Time: 30 seconds or less (at 210 °C)
Count: 3, Exposure limit
Note
: None
IR35-00-3
VPS
Package peak temperature: 215 °C or below
Time: 40 seconds or less (at 200 °C)
Count: 3, Exposure limit
Note
: None
VP15-00-3
Wave Soldering
Soldering bath temperature: 260 °C or below
Time: 10 seconds or less
Count: 1, Exposure limit
Note
: None
WS60-00-1
Partial Heating
Pin temperature: 300 °C
Time: 3 seconds or less (per side of device)
Exposure limit
Note
: None
–
Note
After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
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