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參數(shù)資料
| 型號： | μPC8112T |
| 廠商： | NEC Corp. |
| 英文描述： | Silicon MMIC 1st Frequency Down-Converter(下變頻轉(zhuǎn)換器單片微波集成電路) |
| 中文描述： | 硅單片第一頻率下轉(zhuǎn)換器（下變頻轉(zhuǎn)換器單片微波集成電路） |
| 文件頁數(shù)： | 18/20頁 |
| 文件大小： | 129K |
| 代理商： | ΜPC8112T |
Data Sheet P10764EJ3V0DS00
18
μ
PC8112T
NOTE ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation).
(3) Keep the track length of the ground pins as short as possible.
(4) The bypass capacitor (example: 1 000 pF) should be attached to the V
CC
pin.
(5) The matching circuit should be externally attached to the IF output pin.
(6) The DC cut capacitor must be each attached to the input and output pins.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your NEC sales representative.
Soldering Method
Soldering Conditions
Recommended Condition Symbol
Infrared Reflow
Package peak temperature: 235
°
C or below
Time: 30 seconds or less (at 210
°
C)
Count: 3, Exposure limit: None
Note
IR35-00-3
VPS
Package peak temperature: 215
°
C or below
Time: 40 seconds or less (at 200
°
C)
Count: 3, Exposure limit: None
Note
VP15-00-3
Wave Soldering
Soldering bath temperature: 260
°
C or below
Time: 10 seconds or less
Count: 1, Exposure limit: None
Note
WS60-00-1
Partial Heating
Pin temperature: 300
°
C
Time: 3 seconds or less (per side of device)
Exposure limit: None
Note
–
Note
After opening the dry pack, keep it in a place below 25
°
C and 65 % RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
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