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參數(shù)資料
| 型號(hào)： | μPC8001 |
| 廠商： | NEC Corp. |
| 英文描述： | IF Amplifier IC(中頻放大器) |
| 中文描述： | 中頻放大器集成電路（中頻放大器） |
| 文件頁(yè)數(shù)： | 20/22頁(yè) |
| 文件大?。?/td> | 111K |
| 代理商： | ΜPC8001 |
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μ
PC8001
20
7. RECOMMENDED SOLDERING CONDITIONS
The following conditions must be met for soldering conditions of the
μ
PC8001. For more details,
refer to our document “ SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL” (IEI-1207).
Please consolt with our sales offices in case other soldering process is used, or in case the soldering is
done under different conditions.
Types of Surface Mount Device
μ
PC8001GR: 14-pin plastic shrink SOP (225 mil)
Soldedering process
Soldering conditions
Symbol
Infrared ray reflow
Peak temperature of package surface: 235 C or below,
Reflow time: 30 seconds or below (210 C or higher),
Number of reflow processes: MAX. 2
IR35-107-2
[Remark]
(1)
Please start the second reflow process after the temperature,
raised by the first reflow process, returns to normal.
Please avoid removing the residual flux with water after the
first reflow process.
(2)
Partial heating
method
Terminal temperature: 300 C or below,
Time: 3 seconds or below (Per one side of the device).
———
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