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參數(shù)資料
| 型號： | μPC2776T |
| 廠商： | NEC Corp. |
| 英文描述： | Wideband, Medium Output Amplifier.(寬帶、中等輸出放大器集成電路) |
| 中文描述： | 寬帶，中輸出放大器。（寬帶，中等輸出放大器集成電路） |
| 文件頁數(shù)： | 11/12頁 |
| 文件大?。?/td> | 91K |
| 代理商： | ΜPC2776T |
11
μ
PC2776T
NOTE ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation). All
the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor (e.g. 1 000 pF) should be attached to the V
CC
pin.
(4) The inductor must be attached between V
CC
and output pin (eg. 100 nH).
(5) The DC cut capacitor must be each attached to the input and output pins.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods and conditions
than the recommended conditions are to be consulted with our sales representatives.
μ
PC2776T
Soldering method
Soldering conditions
Recommended condition
symbol
Infrared ray reflow
Package peak temperature: 235 C, Hour: within 30 s.
(more than 210 C), Time: 3 times, Limited days: no.
Note
IR35-00-3
VPS
Package peak temperature: 215 C, Hour: within 40 s.
(more than 200 C), Time: 3 times, Limited days: no.
Note
VP15-00-3
Wave soldering
Soldering tub temperature: less than 260 C, Hour: within10 s.
Time: 1 time, Limited days: no.
Note
WS60-00-1
Pin part heating
Pin area temperature: less than 300 C, Hour: within 3 s/pin.
Limited days: no.
Note
Note
It is the storage days after opening a dry pack, the storage conditions are 25 C, less than 65 % RH.
Caution The combined use of soldering method is to be avoided (However, except the pin area heating
method).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICON-
DUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535EJ7V0IF00)
.
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