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參數資料
| 型號： | μPC2771T |
| 廠商： | NEC Corp. |
| 英文描述： | Medium-Power High-Frequency Amplifier(中等功率的高頻放大器) |
| 中文描述： | 中等功率高頻放大器（中等功率的高頻放大器） |
| 文件頁數： | 13/14頁 |
| 文件大小： | 140K |
| 代理商： | ΜPC2771T |
13
μ
PC2771T
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to maintain the minimum ground impedance (to prevent undesired
oscillation).
(3) Keep the wiring length of the ground pins as short as possible.
(4) Connect a bypass capacitor to the V
CC
pin.
(5) Insert a inductor (e.g. 300 nH) between output pin and V
CC
pin.
RECOMMENDED SOLDERING CONDITIONS
The conditions listed below shall be satisfied when soldering this product.
Consult your NEC sales offices when using any other soldering process, or when soldering is done under different
conditions.
μ
PC2771T
Note
Exposure limit before soldering after dry-pack package is opened.
Storage conditions: Temperature of 25
°
C and maximum relative humidity of 65%
Caution Do not apply more than a single process at once, except for "Partial heating method".
For details of the recommended soldering conditions, refer to the "SMD Surface Mount Technology Manual"
(C10535EJ7V0IF00).
Infrared ray reflow
VPS
Wave soldering
Partial heating method
Peak package surface temperature
Reflow time
Number of reflow processes
Exposure limit
Note
: 235
°
C
: 30 seconds or less (at 210
°
C or more)
: 3
: None
Peak package surface temperature
Reflow time
Number of reflow processes
Exposure limit
Note
: 215
°
C
: 40 seconds or less (at 200
°
C or more)
: 3
: None
Solder temperature
Flow time
Number of flow processes
Exposure limit
Note
: 260
°
C
: 10 seconds or less
: 1
: None
Solder temperature
Flow time
Exposure limit
Note
: 300
°
C or less
: 3 seconds or less/pin.
: None
IR35-00-3
VP15-00-3
WS60-00-1
SOLDERING CONDITIONS
SOLDERING PROCESS
SYMBOL
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