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參數(shù)資料
| 型號(hào)： | μPC2762T |
| 廠商： | NEC Corp. |
| 英文描述： | High Frequency Amplifier for Mobile Commnication(應(yīng)用于移動(dòng)通信的高頻放大器) |
| 中文描述： | 高頻放大器移動(dòng)Commnication（應(yīng)用于移動(dòng)通信的高頻放大器） |
| 文件頁數(shù)： | 17/18頁 |
| 文件大?。?/td> | 283K |
| 代理商： | ΜPC2762T |
μ
PC2762T,
μ
PC2763T
17
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation). All
the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to the Vcc pin.
(4) The inductor must be attached between V
CC
and output pin. The indactance value should be determined in
accordance with desired frequency.
(5) The DC cut capacitor must be each attached to the input and output pins.
RECOMMENDED SOLDERING CONDITIONS
The conditions listed below shall be satisfied when soldering this product.
Consult your NEC sales offices when using any other soldering process, or when soldering is done under
different conditions.
μ
PC2762T,
μ
PC2763T
SOLDERING PROCESS
SOLDERING CONDITIONS
SYMBOL
Infrared ray reflow
Peak package surface temperature : 235
°
C
Reflow time
Number of reflow processes
Exposure limit
Note
IR35-00-3
: 30 seconds MAX. (at 210
°
C or more)
: 3
: None
VPS
Peak package surface temperature : 215
°
C
Reflow time
Number of reflow processes
Exposure limit
Note
VP15-00-3
: 40 seconds MAX. (at 200
°
C or more)
: 3
: None
Wave soldering
Solder temperature
Flow time
Number of flow processes
Exposure limit
Note
: 260
°
C
: 10 seconds MAX.
: 1
: None
WS60-00-1
Partial heating method
Solder temperature
Flow time
Exposure limit
Note
: 300
°
C or less
: 3 seconds MAX./pin
: None
Note
Exposure limit before soldering after dry-pack package is opened.
Storage conditions: Temperature of 25
°
C and maximum relative humidity of 65 %
Caution
Do not apply more than a single process at once, except for “Partial heating method”.
For details of the recommended soldering conditions, refer to the “SMD Surface Mount Technology Manual”
(C10535EJ7V0IF00).
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