參數(shù)資料
型號(hào): μPC2749T
廠商: NEC Corp.
英文描述: Buffer Amplifiers IC(帶緩沖的放大器集成電路)
中文描述: 緩沖放大器集成電路(帶緩沖的放大器集成電路)
文件頁(yè)數(shù): 14/16頁(yè)
文件大小: 267K
代理商: ΜPC2749T
μ
PC2745T,
μ
PC2749T
14
NOTE ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to keep minimum ground impedance (to prevent undesired
oscillation).
(3) Keep the track length of the ground pins as short as possible.
(4) Connect a bypass capacitor (e.g. 1 000 pF) to the V
CC
Pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods
and conditions than the recommended conditions are to be consulted with our sales representatives.
μ
PC2745T,
μ
PC2749T
Soldering method
Soldering conditions
Recommended condition
symbol
Infrared ray reflow
Package peak temperature: 235 C, Hour: within 30 s.
(more than 210 C), Time: 2 times, Limited days: no.
Note
IR30-00-2
VPS
Package peak temperature: 215 C, Hour: within 40 s.
(more than 200 C), Time: 2 times, Limited days: no.
Note
VP15-00-2
Wave soldering
Soldering tub temperature: less than 260 C, Hour: within 10 s.
Time: 1 time, Limited days: no.
WS60-00-1
Pin part heating
Pin area temperature: less than 300 C, Hour: within 10s.
Limited days: no.
Note
Note
It is the storage days after opening a dry pack, the storage conditions are 25 C, Iess than 65 % RH.
Caution
The combined use of soldering method is to be avoided (However, except the pin area heating
method).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL
(IEI-1207)
.
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