參數(shù)資料
型號: μPC2746T
廠商: NEC Corp.
英文描述: Bias Silicon MMIC Amplifiers(單片微波集成電路)
中文描述: 偏置硅MMIC放大器(單片微波集成電路)
文件頁數(shù): 18/20頁
文件大?。?/td> 331K
代理商: ΜPC2746T
18
μ
PC2746T, 2747T, 2748T
NOTE ON CORRECT USE
(1) Observe precausions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired operation).
(3) Keep the wiring length of the ground pins as short as possible.
(4) Connect a bypass capacitor (e.g. 1 000 pF) to the V
CC
pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods and conditions
than the recommended conditions are to be consulted with our sales representatives.
μ
PC2746T, 2747T, 2748T
Soldering method
Soldering conditions
Recommended
condition symbol
Infrared ray reflow
Package peak temperature: 235 C, Hour: within 30 s. (more than 210 C)
Time: 3 times, Limited days: no.
*
IR35-00-3
VPS
Package peak temperature: 215 C, Hour: within 40 s. (more than 200 C)
Time: 3 times, Limited days: no.
*
VP15-00-3
Wave soldering
Soldering tub temperature: less than 260 C, Hour: within 10 s.
Time: 1 times, Limited days: no.
*
WS60-00-1
Pin part heating
Pin area temperature: 300 C, Hour: within 3 s/pin.
Limited days: no.
*
*: It is the storage days after opening a dry pack, the storage conditions are 25 C, less than 65 % RH.
Note 1.
The combined use of soldering method is to be avoided (However, except the pin area heating method).
For details of recommended soldering conditions for surface mounting, refer to information document SEMICON-
DUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10537EJ7V0IF00).
相關(guān)PDF資料
PDF描述
μPC2747T Bias Silicon MMIC Amplifiers(單片微波集成電路)
μPC2748T Bias Silicon MMIC Amplifiers(單片微波集成電路)
μPC2747TB 3 V, Super Minimold Silicon MMIC Amplifier For Mobile Communication(單片微波放大器)
μPC2748TB 3 V, Super Minimold Silicon MMIC Amplifier For Mobile Communication(單片微波放大器)
μPC2771T Medium-Power High-Frequency Amplifier(中等功率的高頻放大器)
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