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參數(shù)資料
| 型號： | μPC2709TB |
| 廠商： | NEC Corp. |
| 英文描述： | 5 V, Minicold Silicon MMIC Medium Output Power Amplifier(中等輸出功率放大器) |
| 中文描述： | 5伏，迷你冷軋硅中等輸出功率單片放大器（中等輸出功率放大器） |
| 文件頁數(shù)： | 13/16頁 |
| 文件大?。?/td> | 115K |
| 代理商： | ΜPC2709TB |
13
μ
PC2709TB
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to V
CC
line.
(4) The inductor must be attached between V
CC
and output pins. The inductance value should be determined in
accordance with desired frequency.
(5) The DC cut capacitor must be attached to input pin.
This product should be soldered in the following recommended conditions. Other soldering methods and condi-
tions than the recommended conditions are to be consulted with our sales representatives.
Soldering method
Soldering conditions
Recommended condition symbol
Infrared ray reflow
Package peak temperature: 235
°
C
Hour: within 30 s. (more than 210
°
C)
Time: 3 times, Limited days: no.*
IR35-00-3
VPS
Package peak temperature: 215
°
C
Hour: within 40 s. (more than 200
°
C)
Time: 3 times, Limited days: no.*
VP15-00-3
Wave soldering
Soldering tub temperature: less than 260
°
C, Hour: within 10 s.
Time: 1 times, Limited days: no.*
WS60-00-1
Pin part heating
Pin area temperature: 300
°
C, Hour: within 3 s/pin.
Limited days: no.*
* It is the storage days after opening a dry pack, the storage conditions are 25
°
C, less than 65 % RH.
Note 1
. The combined use of soldering method is to be avoided (However, except the pin area heating method).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
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