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參數(shù)資料
| 型號(hào)： | μPC2709T |
| 廠商： | NEC Corp. |
| 英文描述： | 5 V, Minicold Silicon MMIC Medium Output Power Amplifier(中等輸出功率放大器) |
| 中文描述： | 5伏，迷你冷軋硅中等輸出功率單片放大器（中等輸出功率放大器） |
| 文件頁(yè)數(shù)： | 13/16頁(yè) |
| 文件大?。?/td> | 177K |
| 代理商： | ΜPC2709T |
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13
μ
PC2709T
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to V
CC
line.
(4) The inductor must be attached between V
CC
and output pins. The inductance value should be determined in
accordance with desired frequency.
(5) The DC cut capacitor must be attached to input pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and condi-
tions other than those recommended below, contact your NEC sales representative.
Soldering Method
Soldering Conditions
Recommended Condition Symbol
Infrared Reflow
Package peak temperature: 235
°
C or below
Time: 30 seconds or less (at 210
°
C)
Count: 3, Exposure limit
Note
: None
IR35-00-3
VPS
Package peak temperature: 215
°
C or below
Time: 40 seconds or less (at 200
°
C)
Count: 3, Exposure limit
Note
: None
VP15-00-3
Wave Soldering
Soldering bath temperature: 260
°
C or below
Time: 10 seconds or less
Count: 1, Exposure limit
Note
: None
WS60-00-1
Partial Heating
Pin temperature: 300
°
C
Time: 3 seconds or less (per pin row)
Exposure limit
Note
: None
Note
After opening the dry pack, keep it in a place below 25
°
C and 65 % RH for the allowable storage period.
Caution
Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
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