- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄384063 > μPC1678G (NEC Corp.) Wideband Si MMIC Amplifier(寬帶放大器) PDF資料下載
參數(shù)資料
| 型號(hào)： | μPC1678G |
| 廠商： | NEC Corp. |
| 英文描述： | Wideband Si MMIC Amplifier(寬帶放大器) |
| 中文描述： | 寬帶硅單片放大器（寬帶放大器） |
| 文件頁(yè)數(shù)： | 12/16頁(yè) |
| 文件大?。?/td> | 94K |
| 代理商： | ΜPC1678G |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)當(dāng)前第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)
Data Sheet P11491EJ4V0DS00
12
μ
PC1678G
NOTE ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to keep mininum ground impedance (to prevent undesired
oscillation).
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to V
CC
line.
(4) The inductor must be attached between V
CC
and output pins. The inductance value should be determined in
accordance with desired frequency.
(5) The DC cut capacitor must be each attached to the input and output pins.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your NEC sales representative.
Soldering Method
Soldering Conditions
Recommended Condition Symbol
Infrared Reflow
Package peak temperature: 235 °C or below
Time: 30 seconds or less (at 210 °C)
Count: 3, Exposure limit
Note
: None
IR35-00-3
VPS
Package peak temperature: 215 °C or below
Time: 40 seconds or less (at 200 °C)
Count: 3, Exposure limit
Note
: None
VP15-00-3
Wave Soldering
Soldering bath temperature: 260 °C or below
Time: 10 seconds or less
Count: 1, Exposure limit
Note
: None
WS60-00-1
Partial Heating
Pin temperature: 300 °C
Time: 3 seconds or less (per side of device)
Exposure limit
Note
: None
–
Note
After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period.
Caution
Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E)
.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| μPC1679G | 1.8 GHz Wideband Si MMIC AMPLIFIER(1.8 GHz 寬帶放大器) |
| μPC1688G | 5 V, 1.1 GHz Wide Band And Flat Gain Amplifier Sillicon MMIC(寬帶放大器微波單片微波集成電路) |
| μPC2709TB | 5 V, Minicold Silicon MMIC Medium Output Power Amplifier(中等輸出功率放大器) |
| μPC2709T | 5 V, Minicold Silicon MMIC Medium Output Power Amplifier(中等輸出功率放大器) |
| μPC2710TB | 5 V, Minicold Silicon MMIC Medium Output Power Amplifier(中等輸出功率放大器) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PC16C57 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microcontroller Architecture |
| PC16CH07CP06104A2020TA | 功能描述:電位計(jì) 100Kohms 16mm 4gang RoHS:否 制造商:Bourns 產(chǎn)品:Musical Syst Potentiometer 安裝風(fēng)格:Panel 錐度:Audio, Linear 轉(zhuǎn)數(shù): 電阻:500 kOhms 元件類型:Carbon 軸類型:Round / Plain 端接類型:Solder Lug 電壓額定值:200 V 功率額定值:0.2 W 容差:20 % |
| PC16CH07CP06504A2020TA | 功能描述:電位計(jì) 500Kohms 16mm 4gang RoHS:否 制造商:Bourns 產(chǎn)品:Musical Syst Potentiometer 安裝風(fēng)格:Panel 錐度:Audio, Linear 轉(zhuǎn)數(shù): 電阻:500 kOhms 元件類型:Carbon 軸類型:Round / Plain 端接類型:Solder Lug 電壓額定值:200 V 功率額定值:0.2 W 容差:20 % |
| PC16DH07CP04-103A2020--TA | 制造商:Piher Sensors and Controls 功能描述: |
| PC16DH07CP04-103B2020--TA | 制造商:Piher Sensors and Controls 功能描述: |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。