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參數(shù)資料
| 型號： | XCV812E-7BG556I |
| 廠商： | Xilinx, Inc. |
| 英文描述： | Virtex-E 1.8 V Extended Memory Field Programmable Gate Arrays |
| 中文描述： | 的Virtex娥內(nèi)存擴(kuò)展1.8伏現(xiàn)場可編程門陣列 |
| 文件頁數(shù)： | 49/116頁 |
| 文件大小： | 1087K |
| 代理商： | XCV812E-7BG556I |
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Virtex-E 1.8 V Extended Memory Field Programmable Gate Arrays
DS025-2 (v2.1) July 17, 2002
www.xilinx.com
1-800-255-7778
Module 2 of 4
45
R
Termination Resistor Packs
Resistor packs are available with the values and the config-
uration required for LVDS and LVPECL termination from
Bourns, Inc., as listed in Table. For pricing and availability,
please contact Bourns directly at
www.bourns.com
.
LVDS Design Guide
The SelectI/O library elements have been expanded for Vir-
tex-E devices to include new LVDS variants. At this time all
of the cells might not be included in the Synthesis libraries.
The 2.1i-Service Pack 2 update for Alliance and Foundation
software includes these cells in the VHDL and Verilog librar-
ies. It is necessary to combine these cells to create the
P-side (positive) and N-side (negative) as described in the
input, output, 3-state and bidirectional sections.
Creating LVDS Global Clock Input Buffers
The global clock input buffer can be combined with the adja-
cent IOB to form an LVDS clock input buffer. The P-side
resides in the GCLKPAD location and the N-side resides in
the adjacent IO_LVDS_DLL site.
HDL Instantiation
Only one global clock input buffer is required to be instanti-
ated in the design and placed on the correct GCLKPAD
location. The N-side of the buffer is reserved and no other
IOB is allowed to be placed on this location.
In the physical device, a configuration option is enabled that
routes the pad wire to the differential input buffer located in
the GCLKIOB. The output of this buffer then drives the out-
put of the GCLKIOB cell. In EPIC it appears that the second
buffer is unused. Any attempt to use this location for another
purpose leads to a DRC error in the software.
VHDL Instantiation
gclk0_p : IBUFG_LVDS port map
(I=>clk_external, O=>clk_internal);
Verilog Instantiation
IBUFG_LVDS gclk0_p (.I(clk_external),
.O(clk_internal));
Location Constraints
All LVDS buffers must be explicitly placed on a device. For
the global clock input buffers this can be done with the fol-
lowing constraint in the UCF or NCF file.
NET clk_external LOC = GCLKPAD3;
GCLKPAD3 can also be replaced with the package pin
name, such as D17 for the BG432 package.
Optional N-Side
Some designers might prefer to also instantiate the N-side
buffer for the global clock buffer. This allows the top-level net
list to include net connections for both PCB layout and sys-
tem-level integration. In this case, only the output P-side
IBUFG connection has a net connected to it. Since the
N-side IBUFG does not have a connection in the EDIF net
list, it is trimmed from the design in MAP.
VHDL Instantiation
gclk0_p : IBUFG_LVDS port map
(I=>clk_p_external, O=>clk_internal);
gclk0_n : IBUFG_LVDS port map
(I=>clk_n_external, O=>clk_internal);
Verilog Instantiation
IBUFG_LVDS gclk0_p (.I(clk_p_external),
.O(clk_internal));
IBUFG_LVDS gclk0_n (.I(clk_n_external),
.O(clk_internal));
Location Constraints
All LVDS buffers must be explicitly placed on a device. For
the global clock input buffers this can be done with the fol-
lowing constraint in the UCF or NCF file.
NET clk_p_external LOC = GCLKPAD3;
NET clk_n_external LOC = C17;
Table 40:
Bourns LVDS/LVPECL Resistor Packs
Part Number
I/O Standard
Term.
for:
Pairs/
Pack
Pins
CAT16
LV2F6
LVDS
Driver
2
8
CAT16
LV4F12
LVDS
Driver
4
16
CAT16
PC2F6
LVPECL
Driver
2
8
CAT16
PC4F12
LVPECL
Driver
4
16
CAT16
PT2F2
LVDS/LVPECL
Receiver
2
8
CAT16
PT4F4
LVDS/LVPECL
Receiver
4
16
Figure 58:
LVDS Elements
Table 41:
Global Clock Input Buffer Pair Locations
Pkg
Pair 3
Pair 2
Pair 2
Pair 0
P
N
P
N
P
N
P
N
BG560
A17
C18
D17
E17
AJ17
AM18
AL17
AM17
FG676
E13
B13
C13
F14
AB13
AF13
AA14
AC14
FG900
C15
A15
E15
E16
AK16
AH16
AJ16
AF16
O
I
IBUF_LVDS
O
I
OBUF_LVDS
IOBUF_LVDS
O
O
T
I
OBUFT_LVDS
O
I
IBUFG_LVDS
IO
T
I
x133_22_122299
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| XCV812E-7BG560C | Virtex-E 1.8 V Extended Memory Field Programmable Gate Arrays |
| XCV812E-7BG560I | Virtex-E 1.8 V Extended Memory Field Programmable Gate Arrays |
| XCV812E-7BG676C | Virtex-E 1.8 V Extended Memory Field Programmable Gate Arrays |
| XCV812E-7BG676I | Virtex-E 1.8 V Extended Memory Field Programmable Gate Arrays |
| XCV812E-7BG900C | Virtex-E 1.8 V Extended Memory Field Programmable Gate Arrays |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| XCV812E-7BG560C | 功能描述:IC FPGA 1.8V C-TEMP 560-MBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Virtex®-E EM 產(chǎn)品變化通告:XC4000(E,L) Discontinuation 01/April/2002 標(biāo)準(zhǔn)包裝:24 系列:XC4000E/X LAB/CLB數(shù):100 邏輯元件/單元數(shù):238 RAM 位總計(jì):3200 輸入/輸出數(shù):80 門數(shù):3000 電源電壓:4.5 V ~ 5.5 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:120-BCBGA 供應(yīng)商設(shè)備封裝:120-CPGA（34.55x34.55） |
| XCV812E-7BG560I | 制造商:XILINX 制造商全稱:XILINX 功能描述:Virtex-E 1.8 V Extended Memory Field Programmable Gate Arrays |
| XCV812E-7BG676C | 制造商:XILINX 制造商全稱:XILINX 功能描述:Virtex-E 1.8 V Extended Memory Field Programmable Gate Arrays |
| XCV812E-7BG676I | 制造商:XILINX 制造商全稱:XILINX 功能描述:Virtex-E 1.8 V Extended Memory Field Programmable Gate Arrays |
| XCV812E-7BG900C | 制造商:XILINX 制造商全稱:XILINX 功能描述:Virtex-E 1.8 V Extended Memory Field Programmable Gate Arrays |
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