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參數(shù)資料
| 型號： | XCV300E-7BG352I |
| 廠商： | XILINX INC |
| 元件分類： | FPGA |
| 英文描述： | Field Programmable Gate Arrays |
| 中文描述： | FPGA, 1536 CLBS, 82944 GATES, 400 MHz, PBGA352 |
| 封裝： | BGA-352 |
| 文件頁數(shù)： | 4/5頁 |
| 文件大小： | 87K |
| 代理商： | XCV300E-7BG352I |
Virtex-E Ordering Information
Revision History
The following table shows the revision history for this document.
Figure 1:
Ordering Information
Date
Version
Revision
12/7/99
1.0
Initial Xilinx release.
1/10/00
1.1
Re-released with spd.txt v. 1.18, FG860/900/1156 package information, and additional DLL,
Select RAM and SelectI/O information.
1/28/00
1.2
Added Delay Measurement Methodology table, updated SelectI/O section, Figures 30, 54,
& 55, text explaining Table 5, T
BYP
values, buffered Hex Line info, p. 8, I/O Timing
Measurement notes, notes for Tables 15, 16, and corrected F1156 pinout table footnote
references.
2/29/00
1.3
Updated pinout tables, V
CC
page 20, and corrected Figure 20.
5/23/00
1.4
Correction to table on p. 22.
7/10/00
1.5
Numerous minor edits.
Data sheet upgraded to Preliminary.
Preview -8 numbers added to
Virtex-E Electrical Characteristics
tables.
Reformatted entire document to follow new style guidelines.
Changed speed grade
values in tables on pages 35-37.
Min values added to
Virtex-E Electrical Characteristics
tables.
XCV2600E and XCV3200E numbers added to
Virtex-E Electrical Characteristics
tables (Module 3).
Corrected user I/O count for XCV100E device in Table 1 (Module 1).
Changed several pins to
“
No Connect in the XCV100E
“
and removed duplicate V
CCINT
pins in Table ~ (Module 4).
Changed pin J10 to
“
No connect in XCV600E
”
in Table 74 (Module 4).
Changed pin J30 to
“
VREF option only in the XCV600E
”
in Table 74 (Module 4).
Corrected pair 18 in Table 75 (Module 4) to be
“
AO in the XCV1000E, XCV1600E
“
.
8/1/00
1.6
9/20/00
1.7
Example: XCV300E-6PQ240C
Device Type
Temperature Range
C = Commercial (Tj = 0 C to +85 C)
I = Industrial (Tj = -40 C to +100 C)
Number of Pins
Package Type
BG = Ball Grid Array
FG = Fine Pitch Ball Grid Array
HQ = High Heat Dissipation
Speed Grade
(-6, -7, -8)
DS022_043_072000
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| XCV300E-7CS144C | TAPE, SEMICOND, RUBBER, 19MMX4.5M; Length, Reel (Metric):45m; Length, tape:45m; Material:Ethylene Propylene Rubber; Width, tape:19mm RoHS Compliant: NA |
| XCV300E-7CS144I | TAPE, CORONA, CHEMRES, 25MMX9.15M; Length, Reel (Metric):9.15m; Width, external:25mm RoHS Compliant: NA |
| XCV300E-7FG256C | Fire Barrier Caulk; Pack Quantity:1 RoHS Compliant: Yes |
| XCV300E-7FG256I | SOCKET-DIP, 8P, MACH CONT, .3LS, .18HI, GOLD |
| XCV1000E-6BG240C | Virtex⑩-E 1.8 V Field Programmable Gate Arrays |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| XCV300E-7BG432C | 功能描述:IC FPGA 1.8V C-TEMP 432-MBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Virtex®-E 產(chǎn)品變化通告:Step Intro and Pkg Change 11/March/2008 標(biāo)準(zhǔn)包裝:1 系列:Virtex®-5 SXT LAB/CLB數(shù):4080 邏輯元件/單元數(shù):52224 RAM 位總計:4866048 輸入/輸出數(shù):480 門數(shù):- 電源電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:1136-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5 |
| XCV300E-7BG432I | 功能描述:IC FPGA 1.8V I-TEMP 432-MBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Virtex®-E 產(chǎn)品變化通告:Step Intro and Pkg Change 11/March/2008 標(biāo)準(zhǔn)包裝:1 系列:Virtex®-5 SXT LAB/CLB數(shù):4080 邏輯元件/單元數(shù):52224 RAM 位總計:4866048 輸入/輸出數(shù):480 門數(shù):- 電源電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:1136-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5 |
| XCV300E-7CS144C | 制造商:XILINX 制造商全稱:XILINX 功能描述:Field Programmable Gate Arrays |
| XCV300E-7CS144I | 制造商:XILINX 制造商全稱:XILINX 功能描述:Field Programmable Gate Arrays |
| XCV300E-7FG204C | 制造商:XILINX 制造商全稱:XILINX 功能描述:Virte -E 1.8 V Field Programmable Gate Arrays |
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