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參數資料
| 型號： | XCV200-5BG352C |
| 廠商： | XILINX INC |
| 元件分類： | FPGA |
| 英文描述： | Field Programmable Gate Arrays |
| 中文描述： | FPGA, 1176 CLBS, 236666 GATES, 294 MHz, PBGA352 |
| 封裝： | BGA-352 |
| 文件頁數： | 2/4頁 |
| 文件大?。?/td> | 37K |
| 代理商： | XCV200-5BG352C |
Virtex
2.5 V Field Programmable Gate Arrays
R
Module 1 of 4
2
1-800-255-7778DS003-1 (v2.5 ) April 2, 2001
Product Specification
Virtex Architecture
Virtex devices feature a flexible, regular architecture that
comprises an array of configurable logic blocks (CLBs) sur-
rounded by programmable input/output blocks (IOBs), all
interconnected by a rich hierarchy of fast, versatile routing
resources. The abundance of routing resources permits the
Virtex family to accommodate even the largest and most
complex designs.
Virtex FPGAs are SRAM-based, and are customized by
loading configuration data into internal memory cells. In
some modes, the FPGA reads its own configuration data
from an external PROM (master serial mode). Otherwise,
the configuration data is written into the FPGA (Select-
MAP
, slave serial, and JTAG modes).
The standard Xilinx Foundation
and Alliance Series
Development systems deliver complete design support for
Virtex, covering every aspect from behavioral and sche-
matic entry, through simulation, automatic design transla-
tion and implementation, to the creation, downloading, and
readback of a configuration bit stream.
Higher Performance
Virtex devices provide better performance than previous
generations of FPGA. Designs can achieve synchronous
system clock rates up to 200 MHz including I/O. Virtex
inputs and outputs comply fully with PCI specifications, and
interfaces can be implemented that operate at 33 MHz or 66
MHz. Additionally, Virtex supports the hot-swapping
requirements of Compact PCI.
Xilinx thoroughly benchmarked the Virtex family. While per-
formance is design-dependent, many designs operated
internally at speeds in excess of 100 MHz and can achieve
200 MHz.
Table 2
shows performance data for representa-
tive circuits, using worst-case timing parameters.
Table 2:
Performance for Common Circuit Functions
Function
Bits
Virtex -6
Register-to-Register
Adder
16
64
5.0 ns
7.2 ns
Pipelined Multiplier
8 x 8
16 x 16
5.1 ns
6.0 ns
Address Decoder
16
64
4.4 ns
6.4 ns
16:1 Multiplexer
5.4 ns
Parity Tree
9
18
36
4.1 ns
5.0 ns
6.9 ns
Chip-to-Chip
HSTL Class IV
200 MHz
LVTTL,16mA, fast slew
180 MHz
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| XCV200-5BG352I | Field Programmable Gate Arrays |
| XCV200-5FG256C | Field Programmable Gate Arrays |
| XCV200-5FG256I | Field Programmable Gate Arrays |
| XCV200-5FG456C | Field Programmable Gate Arrays |
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相關代理商/技術參數 |
參數描述 |
|---|---|
| XCV200-5BG352I | 功能描述:IC FPGA 2.5V I-TEMP 352-MBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現場可編程門陣列） 系列:Virtex® 標準包裝:1 系列:Kintex-7 LAB/CLB數:25475 邏輯元件/單元數:326080 RAM 位總計:16404480 輸入/輸出數:350 門數:- 電源電壓:0.97 V ~ 1.03 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:900-BBGA，FCBGA 供應商設備封裝:900-FCBGA（31x31） 其它名稱:122-1789 |
| XCV200-5FG256C | 功能描述:IC FPGA 2.5V C-TEMP 256-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現場可編程門陣列） 系列:Virtex® 標準包裝:1 系列:Kintex-7 LAB/CLB數:25475 邏輯元件/單元數:326080 RAM 位總計:16404480 輸入/輸出數:350 門數:- 電源電壓:0.97 V ~ 1.03 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:900-BBGA，FCBGA 供應商設備封裝:900-FCBGA（31x31） 其它名稱:122-1789 |
| XCV200-5FG256I | 功能描述:IC FPGA 2.5V I-TEMP 256-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現場可編程門陣列） 系列:Virtex® 標準包裝:1 系列:Kintex-7 LAB/CLB數:25475 邏輯元件/單元數:326080 RAM 位總計:16404480 輸入/輸出數:350 門數:- 電源電壓:0.97 V ~ 1.03 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:900-BBGA，FCBGA 供應商設備封裝:900-FCBGA（31x31） 其它名稱:122-1789 |
| XCV200-5FG456C | 功能描述:IC FPGA 2.5V C-TEMP 456-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現場可編程門陣列） 系列:Virtex® 標準包裝:1 系列:Kintex-7 LAB/CLB數:25475 邏輯元件/單元數:326080 RAM 位總計:16404480 輸入/輸出數:350 門數:- 電源電壓:0.97 V ~ 1.03 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:900-BBGA，FCBGA 供應商設備封裝:900-FCBGA（31x31） 其它名稱:122-1789 |
| XCV200-5FG456I | 功能描述:IC FPGA 2.5V I-TEMP 456-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現場可編程門陣列） 系列:Virtex® 標準包裝:1 系列:Kintex-7 LAB/CLB數:25475 邏輯元件/單元數:326080 RAM 位總計:16404480 輸入/輸出數:350 門數:- 電源電壓:0.97 V ~ 1.03 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:900-BBGA，FCBGA 供應商設備封裝:900-FCBGA（31x31） 其它名稱:122-1789 |
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