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Signal/Connection Descriptions
Ground
1-4
DSP56364 Advance Information
MOTOROLA
1.3
GROUND
Table 1-3 Grounds
Ground
Name
Description
GND
P
PLL Ground
—GND
P
is ground-dedicated for PLL use. The connection should be pro-
vided with an extremely low-impedance path to ground. V
CCP
should be bypassed to
GND
P
by a 0.47
μ
F capacitor located as close as possible to the chip package. There is
one GND
P
connection.
GND
Q
(4)
Quiet Ground
—GND
Q
is an isolated ground for the internal processing logic. This con-
nection must be tied externally to all other chip ground connections. The user must pro-
vide adequate external decoupling capacitors. There are four GND
Q
connections.
GND
A
(4)
Address Bus Ground
—GND
A
is an isolated ground for sections of the address bus
I/O drivers. This connection must be tied externally to all other chip ground connec-
tions. The user must provide adequate external decoupling capacitors. There are four
GND
A
connections.
GND
D
(1)
Data Bus Ground
—GND
D
is an isolated ground for sections of the data bus
I/O drivers. This connection must be tied externally to all other chip ground connec-
tions. The user must provide adequate external decoupling capacitors. There is one
GND
D
connections.
GND
C
(1)
Bus Control Ground
—GND
C
is an isolated ground for the bus control I/O drivers. This
connection must be tied externally to all other chip ground connections. The user must
provide adequate external decoupling capacitors. There is one GND
C
connections.
GND
S
(3)
SHI and ESAI
—GND
S
is an isolated ground for the SHI and ESAI. This connection
must be tied externally to all other chip ground connections. The user must provide
adequate external decoupling capacitors. There are three GND
S
connections.
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.