參數(shù)資料
型號: XCB56364FU100
廠商: MOTOROLA INC
元件分類: 數(shù)字信號處理
英文描述: 24-Bit Audio Digital Signal Processor
中文描述: 8-BIT, 100 MHz, OTHER DSP, PQFP100
封裝: PLASTIC, TQFP-100
文件頁數(shù): 1/162頁
文件大小: 2405K
代理商: XCB56364FU100
This document contains information on a new product. Specifications and information herein are subject to change without notice.
IMOTOROLA
DSP56364 Advance Information
1
Overview
The DSP56364 supports digital audio applications requiring sound field processing,
acoustic equalization, and other digital audio algorithms. The DSP56364 uses the
high performance, single-clock-per-cycle DSP56300 core family of programmable
CMOS digital signal processors (DSPs) combined with the audio signal processing
capability of the Motorola Symphony DSP family, as shown in
Figure 1
. This
design provides a two-fold performance increase over Motorola’s popular
Symphony family of DSPs while retaining code compatibility. Significant
architectural enhancements include a barrel shifter, 24-bit addressing, instruction
cache, and direct memory access (DMA). The DSP56364 offers 100 million
instructions per second (MIPS) using an internal 100 MHz clock at 3.3 V.
Data Sheet Conventions
This data sheet uses the following conventions:
OVERBAR
Used to indicate a signal that is active when pulled low (For
example, the RESET pin is active when low.)
“asserted”
Means that a high true (active high) signal is high or that a low
true (active low) signal is low
“deasserted”
Means that a high true (active high) signal is low or that a low
true (active low) signal is high
Examples:
Signal/
Symbol
Logic State
Signal State
Voltage*
PIN
True
Asserted
V
IL
/ V
OL
PIN
False
Deasserted
V
IH
/ V
OH
PIN
True
Asserted
V
IH
/ V
OH
PIN
False
Deasserted
V
IL
/ V
OL
Note: *Values for V
IL
, V
OL
, V
IH
, and V
OH
are defined by individual product
specifications.
Advance Information
DSP56364/D
Rev. 3.2, 08/2003
24-Bit Audio Digital
Signal Processor
Topic
Overview .....................................i
Features ....................................ii
Signal/Connection
Descriptions .......................1-1
Specifications ..........................2-1
Packaging ...............................3-1
Design Considerations ...........4-1
Ordering Information ...............5-1
IBIS Model .............................A-1
Page
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.
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