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參數(shù)資料
| 型號(hào)： | XCA56011BU95 |
| 廠商： | MOTOROLA INC |
| 元件分類： | 數(shù)字信號(hào)處理 |
| 英文描述： | 24-BIT DVD DIGITAL SIGNAL PROCESSOR |
| 中文描述： | 8-BIT, 95 MHz, OTHER DSP, PQFP100 |
| 封裝： | PLASTIC, TQFP-100 |
| 文件頁(yè)數(shù)： | 73/82頁(yè) |
| 文件大小： | 318K |
| 代理商： | XCA56011BU95 |
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Preliminary Information
MOTOROLA
DSP56011 Technical Data Sheet, Rev. 1
4-1
PRELIMINARY
the heat flow is dissipated through the case to the heat sink and out to the ambient
environment. For ceramic packages, in situations where the heat flow is split between
a path to the case and an alternate path through the printed circuit board, analysis of
the device thermal performance may need the additional modeling capability of a
system level thermal simulation tool.
SECTION
4
DESIGN CONSIDERATIONS
THERMAL DESIGN CONSIDERATIONS
An estimation of the chip junction temperature, T
J
, in
°
C can be obtained from the
equation:
Equation 1:
Where:
T
A
= ambient temperature C
θ
JA
= package junction-to-ambient thermal resistance C/ W
D
= power dissipation in package
Historically, thermal resistance has been expressed as the sum of a junction-to-case
thermal resistance and a case-to-ambient thermal resistance:
Equation 2:
Where:
R
θ
JA
= package junction-to-ambient thermal resistance C/ W
R
θ
JC
= package junction-to-case thermal resistance C/ W
R
θ
CA
= package case-to-ambient thermal resistance C/ W
R
θ
JC
is device-related and cannot be influenced by the user. The user controls the
thermal environment to change the case-to-ambient thermal resistance, R
θ
CA
. For
example, the user can change the air flow around the device, add a heat sink, change
the mounting arrangement on the printed circuit board, or otherwise change the
thermal dissipation capability of the area surrounding the device on a printed circuit
T
J
T
D
θ
JA
×
(
)
+
=
R
θ
JA
R
θ
JC
R
θ
CA
+
=
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