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參數(shù)資料
| 型號(hào)： | XC2V500 |
| 廠商： | Xilinx, Inc. |
| 英文描述： | Virtex-II 1.5V Field-Programmable Gate Arrays |
| 中文描述： | 的Virtex - II 1.5V的現(xiàn)場(chǎng)可編程門陣列 |
| 文件頁數(shù)： | 5/7頁 |
| 文件大小： | 127K |
| 代理商： | XC2V500 |
Virtex-II 1.5V Field-Programmable Gate Arrays
R
DS031-1 (v1.7) October 2, 2001
Advance Product Specification
1-800-255-7778Module 1 of 4
5
Boundary Scan
Boundary scan instructions and associated data registers
support a standard methodology for accessing and config-
uring Virtex-II devices that complies with IEEE standards
1149.1 - 1993 and 1532. A system mode and a test mode
are implemented. In system mode, a Virtex-II device per-
forms its intended mission even while executing non-test
boundary-scan instructions. In test mode, boundary-scan
test instructions control the I/O pins for testing purposes.
The Virtex-II Test Access Port (TAP) supports BYPASS,
PRELOAD, SAMPLE, IDCODE, and USERCODE non-test
instructions. The EXTEST, INTEST, and HIGHZ test instruc-
tions are also supported.
Configuration
Virtex-II devices are configured by loading data into internal
configuration memory, using the following five modes:
Slave-serial mode
Master-serial mode
Slave SelectMAP mode
Master SelectMAP mode
Boundary-Scan mode (IEEE 1532)
A Data Encryption Standard (DES) decryptor is available
on-chip to secure the bitstreams. One or two triple-DES key
sets can be used to optionally encrypt the configuration
information.
Readback and Integrated Logic Analyzer
Configuration data stored in Virtex-II configuration memory
can be read back for verification. Along with the configura-
tion data, the contents of all flip-flops/latches, distributed
SelectRAM, and block SelectRAM memory resources can
be read back. This capability is useful for real-time debug-
ging.
The Integrated Logic Analyzer (ILA) core and software pro-
vides a complete solution for accessing and verifying
Virtex-II devices.
Virtex-II Device/Package Combinations
and Maximum I/O
Wire-bond and flip-chip packages are available.
Table 4
and
Table 5
show the maximum possible number of user I/Os in
wire-bond and flip-chip packages, respectively.
Table 6
shows the number of available user I/Os for all device/pack-
age combinations.
CS denotes wire-bond chip-scale ball grid array (BGA)
(0.80 mm pitch).
FG denotes wire-bond fine-pitch BGA (1.00 mm pitch).
FF denotes flip-chip fine-pitch BGA (1.00 mm pitch).
BG denotes standard BGA (1.27 mm pitch).
BF denotes flip-chip BGA (1.27 mm pitch).
The number of I/Os per package include all user I/Os except
the 15 control pins (CCLK, DONE, M0, M1, M2, PROG_B,
PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN,
DXP, AND RSVD) and VBATT.
Table 4:
Wire-Bond Packages Information
Package
CS144
FG256
FG456
FG676
BG575
BG728
Pitch (mm)
0.80
1.00
1.00
1.00
1.27
1.27
Size (mm)
12 x 12
17 x 17
23 x 23
27 x 27
31 x 31
35 x 35
I/Os
92
172
324
484
408
516
Table 5:
Flip-Chip Packages Information
Package
FF896
FF1152
FF1517
BF957
Pitch (mm)
1.00
1.00
1.00
1.27
Size (mm)
31 x 31
35 x 35
40 x 40
40 x 40
I/Os
624
824
1,108
684
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相關(guān)代理商/技術(shù)參數(shù) |
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|---|---|
| XC2V500-4BF957C | 制造商:XILINX 制造商全稱:XILINX 功能描述:Virtex-II 1.5V Field-Programmable Gate Arrays |
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| XC2V500-4BG575I | 制造商:XILINX 制造商全稱:XILINX 功能描述:Virtex-II 1.5V Field-Programmable Gate Arrays |
| XC2V500-4BG728C | 制造商:XILINX 制造商全稱:XILINX 功能描述:Virtex-II 1.5V Field-Programmable Gate Arrays |
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