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參數(shù)資料
| 型號： | XC1701LPC20I |
| 廠商： | XILINX INC |
| 元件分類： | DRAM |
| 英文描述： | Configuration PROMs |
| 中文描述： | 1M X 1 CONFIGURATION MEMORY, PQCC20 |
| 封裝： | PLASTIC, LCC-20 |
| 文件頁數(shù)： | 12/12頁 |
| 文件大?。?/td> | 124K |
| 代理商： | XC1701LPC20I |
R
Marking Information
Due to the small size of the commercial serial PROM packages, the complete ordering part number cannot be marked on
the package. The XC prefix is deleted and the package code is simplified. Device marking is as follows:
Revision History
The following table shows the revision history for this document.
Notes:
1.
2.
3.
When marking the device number on the EL parts, an X is used in place of an EL.
For XC1700E/EL only.
For XC1700L only.
1701L J C
Operating Range/Processing
C =
I
Commercial (T
A
=
0
°
to +70
°
C)
Industrial (T
A
=
–
40
°
to +85
°
C)
=
Package Type
P
S
(2)
V
S
(3)
J
VQ44 = 44-pin Plastic Quad Flat Package
PC44 = 44-pin Plastic Chip Carrier
= 8-pin Plastic DIP
= 8-pin Plastic Small-Outline Package
= 8-pin Plastic Small-Outline Thin Package
= 20-pin Plastic Small-Outline Package
= 20-pin Plastic Leaded Chip Carrier
Device Number
1736E
1765E
1765X
(1)
17128E
17128X
(1)
17256E
17256X
(1)
1704L
1702L
1701
1701L
17512L
Date
Version
Revision
7/14/98
1.1
Major revisions to include the XC1704L, XC1702L, and the XQ1701L devices, packages and
operating conditions. Also revised the timing specifications on
page 9
.
9/8/98
2.0
Revised the marking information for the VQ44. Updated
"DC Characteristics Over Operating
Condition" on page 7
and
page 8
. Added references to the XC4000XLA and XC4000XV
families in
"Xilinx FPGAs and Compatible PROMs" on page 3
and
Figure 2 on page 5
.
12/18/98
2.1
Added Virtex FPGAs to
"Xilinx FPGAs and Compatible PROMs" on page 3
. Added the PC44
package for the XC1702L and XC1704L products.
1/27/99
2.2
Changed Military I
CCS
.
7/8/99
2.3
Changed I
CCS
standby on XC1702/XC1704 from 50
m
A to 300
m
A.
3/30/00
3.0
Combined data sheets XC1700E and XC1700L. Added DS027, removed Military Specs.
Added Virtex-E and EM references.
07/05/00
3.1
Added 4.7K resistor to
Figure 2
, updated format.
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| XC1701LPCG20C | 功能描述:IC PROM SERIAL 1K 20-PLCC RoHS:是 類別:集成電路 (IC) >> 存儲器 - 用于 FPGA 的配置 Proms 系列:- 產品變化通告:Product Discontinuation 28/Jul/2010 標準包裝:98 系列:- 可編程類型:OTP 存儲容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應商設備封裝:8-TSOP 包裝:管件 |
| XC1701LPCG20I | 功能描述:IC PROM SERIAL 1K 20-PLCC RoHS:是 類別:集成電路 (IC) >> 存儲器 - 用于 FPGA 的配置 Proms 系列:- 產品變化通告:Product Discontinuation 28/Jul/2010 標準包裝:98 系列:- 可編程類型:OTP 存儲容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應商設備封裝:8-TSOP 包裝:管件 |
| XC1701LPD8C | 功能描述:IC 1 MB 3.3V SER CONF PROM 8-DIP RoHS:否 類別:集成電路 (IC) >> 存儲器 - 用于 FPGA 的配置 Proms 系列:- 產品變化通告:Product Discontinuation 28/Jul/2010 標準包裝:98 系列:- 可編程類型:OTP 存儲容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應商設備封裝:8-TSOP 包裝:管件 |
| XC1701LPD8I | 制造商:Xilinx 功能描述: |
| XC1701LPDG8C | 功能描述:IC PROM SER CONFIG 1M 3.3V 8-DIP RoHS:是 類別:集成電路 (IC) >> 存儲器 - 用于 FPGA 的配置 Proms 系列:- 產品變化通告:Product Discontinuation 28/Jul/2010 標準包裝:98 系列:- 可編程類型:OTP 存儲容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應商設備封裝:8-TSOP 包裝:管件 |
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