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參數(shù)資料
| 型號(hào)： | HSMX-H670 |
| 英文描述： | Surface Mount Flip Chip LEDs |
| 中文描述： | 倒裝芯片表面貼裝發(fā)光二極管 |
| 文件頁數(shù)： | 7/8頁 |
| 文件大?。?/td> | 242K |
| 代理商： | HSMX-H670 |
Convective IR Reflow
Soldering
For information on IR reflow
soldering, refer to Application
Note 1060,
Surface Mounting
SMI LED Indicator
Components.
Figure 11. Tape Leader and Trailer Dimensions.
Figure 10. Tape Dimensions.
8.00 ± 0.30
(0.315 ± 0.012)
USER FEED
DIRECTION
DIM. A
(SEE TABLE 1)
3.50 ± 0.05
(0.138 ± 0.002)
1.75 ± 0.10
(0.069 ± 0.004)
1.30 ± 0.10
(0.051 ± 0.004)
0.20 ± 0.05
(0.008 ± 0.002)
CARRIER TAPE
COVER TAPE
DIM. B
(SEE TABLE 1)
4.00 ± 0.10
(0.157 ± 0.004)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 ± 0.10
(0.157 ± 0.004)
1.50 + 0.10
0
(0.059 + 0.004)
0
HSMX-H670 SERIES 2.40 (0.094) 1.60 (0.064)
HSMX-H690 SERIES 1.98 (0.078) 1.02 (0.040)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
CATHODE
DIM. A
± 0.10 (0.004)
DIM. B
± 0.10 (0.004)
PART NUMBER
END
START
THERE SHALL BE A
MINIMUM OF 40 mm
(1.57 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS
THERE SHALL BE A
MINIMUM OF 40 mm
(1.57 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
150 mm-360 mm
(5.9 - 14.2 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
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PDF描述 |
|---|---|
| HSMX-H690 | Surface Mount Flip Chip LEDs |
| HSMY-C650 | Surface Mount Chip LEDs |
| HSMG-C650 | Surface Mount Chip LEDs |
| HSMG-C670 | Surface Mount Chip LEDs |
| HSMH-C650 | Surface Mount Chip LEDs |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HSMX-H690 | 制造商:AGILENT 制造商全稱:AGILENT 功能描述:Surface Mount Flip Chip LEDs |
| HSMX-S660 | 制造商:AGILENT 制造商全稱:AGILENT 功能描述:High Performance Surface Mount Chip LEDs |
| HSMX-S670 | 制造商:AGILENT 制造商全稱:AGILENT 功能描述:High Performance Surface Mount Chip LEDs |
| HSMX-S690 | 制造商:AGILENT 制造商全稱:AGILENT 功能描述:High Performance Surface Mount Chip LEDs |
| HSMY-A100 | 制造商:AGILENT 制造商全稱:AGILENT 功能描述:Surface Mount LED Indicator |
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