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參數(shù)資料
| 型號： | UPD754304GS-XXX-A |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 4-BIT, MROM, MICROCONTROLLER, PDSO36 |
| 封裝： | 0.300 INCH, 0.80 MM PITCH, PLASTIC, SSOP-36 |
| 文件頁數(shù)： | 61/73頁 |
| 文件大?。?/td> | 814K |
| 代理商： | UPD754304GS-XXX-A |
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PD754302, 754304, 754302(A), 754304(A)
64
Data Sheet U10797EJ2V1DS
15.
RECOMMENDED SOLDERING CONDITIONS
The
PD754302 and PD754304 should be soldered and mounted under the following recommended
conditions.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Table 15-1. Surface Mounting Type Soldering Conditions
(1)
PD754302GS-xxx:
36-pin plastic shrink SOP (300 mil, 0.8 mm pitch)
PD754304GS-xxx:
36-pin plastic shrink SOP (300 mil, 0.8 mm pitch)
PD754302GS(A)-xxx: 36-pin plastic shrink SOP (300 mil, 0.8 mm pitch)
PD754304GS(A)-xxx: 36-pin plastic shrink SOP (300 mil, 0.8 mm pitch)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°C, Time: 30 seconds max. (at 210°C or higher), IR35-00-2
Count: Twice or less
VPS
Package peak temperature: 215
°C, Time: 40 seconds max. (at 200°C or higher), VP15-00-2
Count: Twice or less
Wave soldering
Solder bath temperature: 260
°C max., Time: 10 seconds max., Count: Once
WS60-00-1
Preheating temperature: 120
°C max. (package surface temperature)
Partial heating
Pin temperature: 350
°C max., Time: 3 seconds max. (per pin row)
–
Caution
Do not use different soldering methods together (except for partial heating).
Remark For soldering methods and conditions other than those recommended above, contact an NEC
Electronics sales representative.
(2)
PD754302GS-xxx-A: 36-pin plastic shrink SOP (300 mil, 0.8 mm pitch)
PD754304GS-xxx-A: 36-pin plastic shrink SOP (300 mil, 0.8 mm pitch)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 260
°C, Time: 60 seconds max. (at 220°C or higher), IR60-207-3
Count: Three times or less,
Exposure limit: 7 daysNote (after that, prebake at 125
°C for 20 to 72 hours)
Wave soldering
For details, contact an NEC Electronics sales representative.
–
Partial heating
Pin temperature: 350
°C max., Time: 3 seconds max. (per pin row)
–
Note
After opening the dry pack, store it at 25
°C or less and 65% RH or less for the allowable storage period.
Caution
Do not use different soldering methods together (except for partial heating).
Remarks 1. Products with “-A” at the end of the part number are lead-free products.
2. For soldering methods and conditions other than those recommended above, contact an NEC
Electronics sales representative.
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相關(guān)代理商/技術(shù)參數(shù) |
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| UPD7554AG-597-E2 | 制造商:Renesas Electronics Corporation 功能描述: |
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| UPD7554AG-603-E2 | 制造商:Renesas Electronics Corporation 功能描述: |
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